Intel Corporation
10AX027H4F35I3LG
10AX027H4F35I3LG ECAD Model
10AX027H4F35I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX027H4F35I3LG Datasheet Download
10AX027H4F35I3LG Overview
The chip model 10AX027H4F35I3LG is a high-performance integrated circuit (IC) designed for digital signal processing, embedded processing, and image processing. It is an advanced device that is capable of providing solutions to complex applications and is designed to be used with the hardware description language (HDL). This chip model is suitable for a wide range of applications and is suitable for high-performance digital signal processing, embedded processing, and image processing.
The chip model 10AX027H4F35I3LG is capable of being used in networks and intelligent scenarios. It is a versatile chip that is capable of being used in the era of fully intelligent systems. The chip model is capable of providing solutions for various applications such as voice recognition, facial recognition, machine learning, and natural language processing. It is also capable of being used in a variety of other applications such as robotics, autonomous vehicles, and medical imaging.
The product description and design requirements of the chip model 10AX027H4F35I3LG are available from the manufacturer. The product description includes the device's physical dimensions, power requirements, and performance specifications. The design requirements include the type of HDL language used, the number of logic gates, the number of pins, and the type of memory used.
The chip model 10AX027H4F35I3LG is a powerful integrated circuit that is capable of providing solutions to complex applications. It is designed to be used with the hardware description language (HDL) and is suitable for a wide range of applications. It is capable of being used in networks and intelligent scenarios, as well as in the era of fully intelligent systems. The product description and design requirements are available from the manufacturer, along with actual case studies and precautions. The chip model is a reliable and cost-effective solution for high-performance digital signal processing, embedded processing, and image processing.
You May Also Be Interested In
5,527 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,745.6529 | $4,745.6529 |
| 10+ | $4,694.6244 | $46,946.2439 |
| 100+ | $4,439.4818 | $443,948.1762 |
| 1000+ | $4,184.3391 | $2,092,169.5660 |
| 10000+ | $3,827.1395 | $3,827,139.4500 |
| The price is for reference only, please refer to the actual quotation! | ||