Intel Corporation
10AX027H4F35E3SG
10AX027H4F35E3SG ECAD Model
10AX027H4F35E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027H4F35E3SG Datasheet Download
10AX027H4F35E3SG Overview
The chip model 10AX027H4F35E3SG is a powerful and versatile chip designed for high-performance digital signal processing, embedded processing, image processing, and more. It is designed to be compatible with the HDL language, which is a common language used in electronic design automation. This makes it an ideal choice for a wide variety of applications, from consumer electronics to industrial automation.
The 10AX027H4F35E3SG has a number of advantages over other chips of its type. It is highly efficient, with a low power consumption and the ability to handle complex tasks. It is also highly reliable and has a long lifespan. This makes it a great choice for applications that require a long-term solution.
The 10AX027H4F35E3SG is also expected to be in high demand in the future. This is due to its versatility and the fact that it can be easily integrated into a variety of systems. This makes it a great choice for applications that require a high level of performance and reliability.
The original design intention of the 10AX027H4F35E3SG was to provide a powerful and reliable solution for digital signal processing, embedded processing, and image processing. It is also designed to be easily upgradable, meaning that it can be adapted to new technologies and applications as they become available. This makes it a great choice for applications that require a long-term solution.
The 10AX027H4F35E3SG is also capable of being used in advanced communication systems. This is due to its advanced features, such as its ability to process large amounts of data quickly and accurately. This makes it a great choice for applications that require high levels of performance and reliability.
In conclusion, the 10AX027H4F35E3SG is a powerful and reliable chip that is designed to be used in a variety of applications. It is highly efficient, reliable, and upgradable, making it a great choice for applications that require a long-term solution. It is also capable of being used in advanced communication systems, making it a great choice for applications that require high levels of performance and reliability.
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4,929 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,768.1161 | $2,768.1161 |
| 10+ | $2,738.3514 | $27,383.5139 |
| 100+ | $2,589.5279 | $258,952.7943 |
| 1000+ | $2,440.7045 | $1,220,352.2490 |
| 10000+ | $2,232.3517 | $2,232,351.6750 |
| The price is for reference only, please refer to the actual quotation! | ||