Intel Corporation
10AX027H4F35E3LG
10AX027H4F35E3LG ECAD Model
10AX027H4F35E3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX027H4F35E3LG Datasheet Download
10AX027H4F35E3LG Overview
The 10AX027H4F35E3LG chip model is a high-performance digital signal processing chip model that is suitable for embedded processing, image processing, and other applications. It requires the use of HDL language, making it a powerful tool for developers.
The 10AX027H4F35E3LG chip model is at the forefront of the industry, as it is able to provide the latest technologies and features to enable developers to create powerful applications. The chip model is able to support the latest technologies, such as artificial intelligence and machine learning, allowing developers to create intelligent applications.
The 10AX027H4F35E3LG chip model is also suitable for use in networks, as it is capable of providing high-speed data processing and communication. It is also capable of providing intelligent solutions, such as facial recognition and voice recognition, making it a powerful tool for developers in the era of fully intelligent systems.
The 10AX027H4F35E3LG chip model is a powerful tool for developers, as it is able to provide the latest technologies and features to enable developers to create powerful applications. It is also capable of providing intelligent solutions, making it a powerful tool for developers in the era of fully intelligent systems. The 10AX027H4F35E3LG chip model is an ideal choice for developers who are looking for a high-performance digital signal processing chip model that is suitable for embedded processing, image processing, and other applications. It is also suitable for use in networks, as it is capable of providing high-speed data processing and communication.
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5,051 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $792.3650 | $792.3650 |
| 10+ | $783.8450 | $7,838.4497 |
| 100+ | $741.2447 | $74,124.4698 |
| 1000+ | $698.6444 | $349,322.2140 |
| 10000+ | $639.0041 | $639,004.0500 |
| The price is for reference only, please refer to the actual quotation! | ||