10AX027H4F34I3SG

The 10AX027H4F34I3SG is an integrated circuit (IC) chip model produced by Xilinx, Inc. It is a field programmable gate array (FPGA) device with a capacity of 27,000 logic cells. It has a maximum power dissipation of 11.8W and a maximum operating temperature of 85°C. The device is packaged in a 7mm x 7mm package with a 0.8mm pitch.

The 10AX027H4F34I3SG provides a high level of integration, with features such as a hard processor system (HPS), dual-core ARM Cortex-A9 processor, and an integrated transceiver. It also features a wide range of I/O capabilities, including a high-speed transceiver, LVDS, and PCI Express. It is designed for a wide range of applications, including industrial control, medical imaging, automotive, and aerospace.

The 10AX027H4F34I3SG provides high-performance and low-power operation, making it suitable for a variety of applications. It has a wide range of features, including a low-voltage differential signaling (LVDS) interface, a high-speed transceiver, and a PCI Express interface. It also features a high-speed clock synthesis, which enables the device to generate clocks up to 800MHz.

The 10AX027H4F34I3SG is a reliable and cost-effective solution for a variety of applications. It is designed for use in a wide range of applications, including industrial control, medical imaging, automotive, and aerospace. It provides a high level of integration, with features such as a hard processor system (HPS), dual-core ARM Cortex-A9 processor, and an integrated transceiver. It also has a wide range of I/O capabilities, including a high-speed transceiver, LVDS, and PCI Express.