Intel Corporation
10AX027H4F34E3SG
10AX027H4F34E3SG ECAD Model
10AX027H4F34E3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027H4F34E3SG Datasheet Download
10AX027H4F34E3SG Overview
The chip model 10AX027H4F34E3SG is an advanced integrated circuit designed to provide reliable performance in communication systems. It is designed to be used in a wide range of applications, including high-speed data transmission, digital signal processing, and wireless communication. The chip is capable of supporting the latest communication protocols, such as 4G/5G and Wi-Fi, and can be used in a variety of network architectures.
The original design intention of the chip model 10AX027H4F34E3SG was to provide a robust and reliable solution for communication networks. It was designed to be used in a variety of scenarios, including high-speed data transmission, digital signal processing, and wireless communication. It is also capable of supporting a wide range of protocols, such as 4G/5G and Wi-Fi, and can be used in a variety of network architectures. The chip is also designed to be easily upgradable, allowing for future upgrades and enhancements.
The chip model 10AX027H4F34E3SG is capable of being used in a variety of intelligent scenarios. It can be used in networks that require high-speed data transmission, digital signal processing, and wireless communication. It is also capable of supporting the latest communication protocols, such as 4G/5G and Wi-Fi, and can be used in a variety of network architectures. It can also be used in the era of fully intelligent systems, as it is designed to be easily upgradable and can be used in a variety of intelligent scenarios.
The product description and specific design requirements of the chip model 10AX027H4F34E3SG are outlined in the product datasheet. The chip is designed to be used in a variety of scenarios, including high-speed data transmission, digital signal processing, and wireless communication. It is also designed to be upgradable, allowing for future upgrades and enhancements. The datasheet also outlines the precautions that should be taken when using the chip, such as ensuring that the circuit is correctly wired and that the appropriate power supply is used.
In addition to the product datasheet, there are also case studies available that provide an insight into the performance of the chip model 10AX027H4F34E3SG. These case studies provide an overview of the chip's performance in various scenarios, such as high-speed data transmission, digital signal processing, and wireless communication. The case studies also provide an insight into the reliability and robustness of the chip, as well as the precautions that should be taken when using the chip.
Overall, the chip model 10AX027H4F34E3SG is an advanced integrated circuit designed to provide reliable performance in communication systems. It is designed to be used in a variety of scenarios, including high-speed data transmission, digital signal processing, and wireless communication. It is also capable of supporting the latest communication protocols, such as 4G/5G and Wi-Fi, and can be used in a variety of network architectures. It is also designed to be easily upgradable, allowing for future upgrades and enhancements. The product description and specific design requirements of the chip model 10AX027H4F34E3SG are outlined in the product datasheet, along with actual case studies and precautions. This makes the chip model 10AX027H4F34E3SG an ideal choice for use in networks and intelligent scenarios in the era of fully intelligent systems.
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4,773 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,768.1161 | $2,768.1161 |
| 10+ | $2,738.3514 | $27,383.5139 |
| 100+ | $2,589.5279 | $258,952.7943 |
| 1000+ | $2,440.7045 | $1,220,352.2490 |
| 10000+ | $2,232.3517 | $2,232,351.6750 |
| The price is for reference only, please refer to the actual quotation! | ||