Intel Corporation
10AX027H3F35I2SG
10AX027H3F35I2SG ECAD Model
10AX027H3F35I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027H3F35I2SG Datasheet Download
10AX027H3F35I2SG Overview
The chip model 10AX027H3F35I2SG is a powerful and versatile chip model that has been widely used in the industry. It is a model of a field-programmable gate array (FPGA) manufactured by Intel, and it is designed to provide a high-performance, low-power solution for many applications. The 10AX027H3F35I2SG is suitable for a variety of applications, ranging from artificial intelligence, machine learning, and robotics to data processing, networking, and communications.
The 10AX027H3F35I2SG is a highly customizable chip model that offers a wide range of features and benefits. It is capable of data processing, networking, and communications, as well as supporting a variety of applications in the field of artificial intelligence, machine learning, and robotics. It is also designed to provide a low-power solution, making it ideal for applications that require long-term operation or require minimal power consumption.
In terms of industry trends, the 10AX027H3F35I2SG is expected to remain popular in the near future, as it is a versatile chip model that is suitable for a variety of applications. As the demand for artificial intelligence, machine learning, and robotics increases, the 10AX027H3F35I2SG is expected to remain a popular choice for these applications. Additionally, the chip model is expected to support the development and popularization of future intelligent robots, as it is designed to provide a low-power solution.
In terms of the technical talents needed to use the 10AX027H3F35I2SG effectively, engineers with a strong knowledge of FPGA design, digital signal processing, and embedded systems will be needed. Additionally, engineers with experience in software development, hardware design, and system integration will also be needed. Furthermore, engineers with experience in artificial intelligence, machine learning, and robotics will be needed to use the 10AX027H3F35I2SG effectively for these applications.
In conclusion, the 10AX027H3F35I2SG is a versatile chip model that is expected to remain popular in the near future, as it is suitable for a variety of applications. It is also expected to support the development and popularization of future intelligent robots, as it is designed to provide a low-power solution. Engineers with a strong knowledge of FPGA design, digital signal processing, and embedded systems, as well as experience in software development, hardware design, and system integration will be needed to use the 10AX027H3F35I2SG effectively. Additionally, engineers with experience in artificial intelligence, machine learning, and robotics will be needed to use the 10AX027H3F35I2SG effectively for these applications.
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3,520 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $976.1304 | $976.1304 |
| 10+ | $965.6344 | $9,656.3439 |
| 100+ | $913.1543 | $91,315.4262 |
| 1000+ | $860.6741 | $430,337.0660 |
| 10000+ | $787.2020 | $787,201.9500 |
| The price is for reference only, please refer to the actual quotation! | ||