Intel Corporation
10AX027H3F35I2LG
10AX027H3F35I2LG ECAD Model
10AX027H3F35I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027H3F35I2LG Datasheet Download
10AX027H3F35I2LG Overview
The chip model 10AX027H3F35I2LG is a highly advanced integrated circuit designed to provide high-performance digital signal processing, embedded processing, and image processing capabilities. It is designed to be used with the HDL (Hardware Description Language) language and is suitable for a wide range of applications, from consumer electronics to industrial automation.
The chip model 10AX027H3F35I2LG is designed with the latest industry trends in mind, making it a perfect choice for those looking for the most up-to-date technology. It is capable of providing the highest level of performance and reliability for a wide range of applications. It also has the potential for future upgrades and improvements, making it a great choice for those looking for the latest and greatest in technology.
The original design intention of the chip model 10AX027H3F35I2LG was to provide a powerful and reliable solution for digital signal processing, embedded processing, and image processing. It has the potential to be used in advanced communication systems and the possibility of future upgrades and improvements. This makes it an ideal choice for those looking for the most advanced technology and solutions.
The chip model 10AX027H3F35I2LG is a powerful and reliable solution for a wide range of applications and can be used with the latest industry trends. Its potential for future upgrades and improvements make it an ideal choice for those looking for the most advanced technology and solutions. With its high-performance capabilities, the chip model 10AX027H3F35I2LG is sure to be a great choice for those looking for the most up-to-date technology and solutions.
You May Also Be Interested In
4,142 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,328.3148 | $5,328.3148 |
| 10+ | $5,271.0210 | $52,710.2104 |
| 100+ | $4,984.5525 | $498,455.2509 |
| 1000+ | $4,698.0840 | $2,349,041.9870 |
| 10000+ | $4,297.0280 | $4,297,028.0250 |
| The price is for reference only, please refer to the actual quotation! | ||