
Intel Corporation
10AX027H3F35E2SG
10AX027H3F35E2SG ECAD Model
10AX027H3F35E2SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 384 | |
Number of Outputs | 384 | |
Number of Logic Cells | 270000 | |
Number of CLBs | 10162 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 10162 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 |
10AX027H3F35E2SG Datasheet Download
10AX027H3F35E2SG Overview
The chip model 10AX027H3F35E2SG is a powerful and versatile tool for modern networks. It is a high-end chip model that is designed to provide a wide range of features, including high-speed data processing and communication, advanced networking capabilities, and integrated security features. It is also designed to support intelligent systems, such as machine learning and artificial intelligence, and is capable of handling complex tasks with ease.
The chip model 10AX027H3F35E2SG can be used in a variety of applications and scenarios, including network security, data processing, and communication. It is capable of providing high-speed data transfer and processing, as well as providing secure and reliable communication between multiple devices. It is also capable of providing advanced networking capabilities, such as routing, switching, and access control. Additionally, it can be used in intelligent systems, such as machine learning and artificial intelligence, as well as in fully intelligent systems.
The chip model 10AX027H3F35E2SG is designed with a range of features that make it suitable for a variety of applications. It has a powerful processor, a large memory capacity, and advanced security features. It is also designed with a wide range of communication protocols, including Ethernet, Wi-Fi, and Bluetooth, which make it suitable for a variety of networking scenarios. Additionally, it is designed to support a wide range of intelligent systems, such as machine learning and artificial intelligence.
In terms of industry trends, the chip model 10AX027H3F35E2SG is becoming increasingly popular due to its versatility and power. It is being used in a variety of applications, from network security to data processing, and it is also being used in intelligent systems. As more and more applications require the support of intelligent systems, the demand for the chip model 10AX027H3F35E2SG is likely to continue to grow.
When considering the product description and specific design requirements of the chip model 10AX027H3F35E2SG, it is important to consider the application environment and the specific technologies that are needed. It is important to ensure that the chip model is compatible with the application environment and has the necessary features to support the desired technology. Additionally, it is important to consider any potential risks or issues that may arise when using the chip model 10AX027H3F35E2SG, such as compatibility issues or security vulnerabilities.
In conclusion, the chip model 10AX027H3F35E2SG is a powerful and versatile tool for modern networks. It is designed to provide a wide range of features, including high-speed data processing and communication, advanced networking capabilities, and integrated security features. It is also designed to support intelligent systems, such as machine learning and artificial intelligence, and is capable of handling complex tasks with ease. When considering the product description and specific design requirements of the chip model 10AX027H3F35E2SG, it is important to consider the application environment and the specific technologies that are needed, as well as any potential risks or issues that may arise when using the chip model. With its versatility and power, the chip model 10AX027H3F35E2SG is becoming increasingly popular and is likely to continue to be used in a variety of applications and scenarios.
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4,040 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $837.0000 | $837.0000 |
10+ | $828.0000 | $8,280.0000 |
100+ | $783.0000 | $78,300.0000 |
1000+ | $738.0000 | $369,000.0000 |
10000+ | $675.0000 | $675,000.0000 |
The price is for reference only, please refer to the actual quotation! |