
Intel Corporation
10AX027H3F35E2LG
10AX027H3F35E2LG ECAD Model
10AX027H3F35E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 384 | |
Number of Outputs | 384 | |
Number of Logic Cells | 270000 | |
Number of CLBs | 10162 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 10162 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1152 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 1152 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1152,34X34,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
Length | 35 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA1152,34X34,40 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991 | |
HTS Code | 8542.39.00.01 |
10AX027H3F35E2LG Datasheet Download
10AX027H3F35E2LG Overview
The chip model 10AX027H3F35E2LG is a highly advanced and powerful chip that was designed with the intention of providing users with a wide range of capabilities and features. This chip was designed to be able to handle large amounts of data, as well as to be able to work in high-speed communication systems. It is a versatile chip that can be used for a variety of applications, including those related to advanced communication systems and intelligent robots.
The product description of the chip model 10AX027H3F35E2LG includes a variety of features that make it an ideal choice for a wide range of applications. It has a maximum frequency of 1.5GHz and a maximum power dissipation of 2.5W. It is also designed to be compatible with a variety of memory interfaces, including DDR3/2, LPDDR3/2, and NAND Flash. Additionally, it has a wide range of features that make it suitable for use in advanced communication systems, such as high-speed serial communications, low-latency message passing, and high-speed data transfer.
The design requirements of the chip model 10AX027H3F35E2LG are also quite extensive. It is designed to be able to handle a variety of tasks, including those related to advanced communication systems. It is also designed to be able to handle a wide range of data types, including those related to audio, video, and text. Additionally, it is designed to be able to handle a variety of different protocols, such as Ethernet, USB, and Wi-Fi.
In order to ensure that the chip model 10AX027H3F35E2LG is able to provide users with the best performance, it is important to understand the various design requirements that go into its production. This includes understanding the various components that make up the chip, such as the processor, memory, and other components. Additionally, it is important to understand the various protocols that are used in the chip, such as Ethernet, USB, and Wi-Fi.
In order to understand the full potential of the chip model 10AX027H3F35E2LG, it is important to look at actual case studies that have been conducted using the chip. These case studies can provide valuable insights into how the chip is able to perform in various scenarios. Additionally, these case studies can also provide useful information about how the chip can be used in various applications, such as those related to advanced communication systems and intelligent robots.
Finally, when it comes to using the chip model 10AX027H3F35E2LG, it is important to understand the various technical talents that are required to use the model effectively. This includes understanding the various components that make up the chip, as well as understanding the various protocols that are used in the chip. Additionally, it is important to have a good understanding of the various software packages that are available for use with the chip, such as those related to advanced communication systems and intelligent robots.
In conclusion, the chip model 10AX027H3F35E2LG is a powerful and versatile chip that was designed with the intention of providing users with a wide range of capabilities and features. It is designed to be able to handle large amounts of data, as well as to be able to work in high-speed communication systems. It is also designed to be compatible with a variety of memory interfaces and protocols, such as Ethernet, USB, and Wi-Fi. Additionally, it is also designed to be able to handle a variety of tasks, such as those related to advanced communication systems and intelligent robots. To use the chip model 10AX027H3F35E2LG effectively, it is important to understand the various components, protocols, and software packages that are associated with the chip, as well as to understand the various case studies that have been conducted using the chip.
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4,731 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $4,568.3501 | $4,568.3501 |
10+ | $4,519.2280 | $45,192.2805 |
100+ | $4,273.6178 | $427,361.7828 |
1000+ | $4,028.0076 | $2,014,003.8040 |
10000+ | $3,684.1533 | $3,684,153.3000 |
The price is for reference only, please refer to the actual quotation! |