10AX027H3F35E2LG
10AX027H3F35E2LG
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rohs

Intel Corporation

10AX027H3F35E2LG


10AX027H3F35E2LG
F18-10AX027H3F35E2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX027H3F35E2LG ECAD Model


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10AX027H3F35E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 384
Number of Outputs 384
Number of Logic Cells 270000
Number of CLBs 10162
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 10162 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
ECCN Code 3A991
HTS Code 8542.39.00.01

10AX027H3F35E2LG Datasheet Download


10AX027H3F35E2LG Overview



The chip model 10AX027H3F35E2LG is a highly advanced and powerful chip that was designed with the intention of providing users with a wide range of capabilities and features. This chip was designed to be able to handle large amounts of data, as well as to be able to work in high-speed communication systems. It is a versatile chip that can be used for a variety of applications, including those related to advanced communication systems and intelligent robots.


The product description of the chip model 10AX027H3F35E2LG includes a variety of features that make it an ideal choice for a wide range of applications. It has a maximum frequency of 1.5GHz and a maximum power dissipation of 2.5W. It is also designed to be compatible with a variety of memory interfaces, including DDR3/2, LPDDR3/2, and NAND Flash. Additionally, it has a wide range of features that make it suitable for use in advanced communication systems, such as high-speed serial communications, low-latency message passing, and high-speed data transfer.


The design requirements of the chip model 10AX027H3F35E2LG are also quite extensive. It is designed to be able to handle a variety of tasks, including those related to advanced communication systems. It is also designed to be able to handle a wide range of data types, including those related to audio, video, and text. Additionally, it is designed to be able to handle a variety of different protocols, such as Ethernet, USB, and Wi-Fi.


In order to ensure that the chip model 10AX027H3F35E2LG is able to provide users with the best performance, it is important to understand the various design requirements that go into its production. This includes understanding the various components that make up the chip, such as the processor, memory, and other components. Additionally, it is important to understand the various protocols that are used in the chip, such as Ethernet, USB, and Wi-Fi.


In order to understand the full potential of the chip model 10AX027H3F35E2LG, it is important to look at actual case studies that have been conducted using the chip. These case studies can provide valuable insights into how the chip is able to perform in various scenarios. Additionally, these case studies can also provide useful information about how the chip can be used in various applications, such as those related to advanced communication systems and intelligent robots.


Finally, when it comes to using the chip model 10AX027H3F35E2LG, it is important to understand the various technical talents that are required to use the model effectively. This includes understanding the various components that make up the chip, as well as understanding the various protocols that are used in the chip. Additionally, it is important to have a good understanding of the various software packages that are available for use with the chip, such as those related to advanced communication systems and intelligent robots.


In conclusion, the chip model 10AX027H3F35E2LG is a powerful and versatile chip that was designed with the intention of providing users with a wide range of capabilities and features. It is designed to be able to handle large amounts of data, as well as to be able to work in high-speed communication systems. It is also designed to be compatible with a variety of memory interfaces and protocols, such as Ethernet, USB, and Wi-Fi. Additionally, it is also designed to be able to handle a variety of tasks, such as those related to advanced communication systems and intelligent robots. To use the chip model 10AX027H3F35E2LG effectively, it is important to understand the various components, protocols, and software packages that are associated with the chip, as well as to understand the various case studies that have been conducted using the chip.



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Unit Price: $4,912.2044
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,568.3501 $4,568.3501
10+ $4,519.2280 $45,192.2805
100+ $4,273.6178 $427,361.7828
1000+ $4,028.0076 $2,014,003.8040
10000+ $3,684.1533 $3,684,153.3000
The price is for reference only, please refer to the actual quotation!

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