10AX027H3F34E2LG
10AX027H3F34E2LG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX027H3F34E2LG


10AX027H3F34E2LG
F18-10AX027H3F34E2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA1152,34X34,40
BGA, BGA1152,34X34,40

10AX027H3F34E2LG ECAD Model


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10AX027H3F34E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 384
Number of Outputs 384
Number of Logic Cells 270000
Number of CLBs 10162
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 10162 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B1152
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 1152
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1152,34X34,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 35 mm
Length 35 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA1152,34X34,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AX027H3F34E2LG Datasheet Download


10AX027H3F34E2LG Overview



Chip model 10AX027H3F34E2LG is a powerful and versatile chip model developed by the leading semiconductor manufacturer, Xilinx, Inc. It is designed to be used in a wide range of applications, from consumer electronics to industrial automation. This chip model is designed to provide a high level of performance and reliability, as well as low power consumption. It is also designed to be easily upgradable and compatible with a variety of communication systems.


The 10AX027H3F34E2LG chip model offers a number of advantages that make it an attractive choice for many industries. It is designed to be highly efficient, reducing power consumption and increasing performance. It also has a wide range of features, such as high speed memory, on-chip debug, and a wide range of I/O options, allowing it to be used in a variety of applications. Furthermore, the chip model is designed to be easily upgradable, allowing for future upgrades and improvements.


The 10AX027H3F34E2LG chip model is expected to be in high demand in the future, as more industries begin to use advanced technologies in their operations. This chip model is an ideal choice for industries that require high performance, low power consumption, and a wide range of features. It is also expected to be used in the development and popularization of future intelligent robots, as it is designed to be easily upgradable and compatible with a variety of communication systems.


In order to use the 10AX027H3F34E2LG chip model effectively, technical talents with knowledge in semiconductor design and programming are required. This chip model requires a good understanding of the design and programming principles in order to maximize its potential. Furthermore, a good understanding of the communication systems that the chip model is compatible with is also necessary in order to ensure that the chip model is used effectively.


In conclusion, the 10AX027H3F34E2LG chip model is a powerful and versatile chip model developed by the leading semiconductor manufacturer, Xilinx, Inc. It is designed to be used in a wide range of applications, from consumer electronics to industrial automation. It offers a number of advantages, such as high efficiency, low power consumption, and a wide range of features. It is expected to be in high demand in the future, as more industries begin to use advanced technologies in their operations. Furthermore, it is also expected to be used in the development and popularization of future intelligent robots. In order to use the chip model effectively, technical talents with knowledge in semiconductor design and programming are required.



1,762 In Stock


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Unit Price: $4,911.8661
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $4,568.0355 $4,568.0355
10+ $4,518.9168 $45,189.1681
100+ $4,273.3235 $427,332.3507
1000+ $4,027.7302 $2,013,865.1010
10000+ $3,683.8996 $3,683,899.5750
The price is for reference only, please refer to the actual quotation!

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