Intel Corporation
10AX027H2F34I2SG
10AX027H2F34I2SG ECAD Model
10AX027H2F34I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX027H2F34I2SG Datasheet Download
10AX027H2F34I2SG Overview
The chip model 10AX027H2F34I2SG is a high-performance, low-power integrated circuit designed for digital signal processing, embedded processing, and image processing applications. It is designed to be compatible with the HDL language, allowing for greater control and flexibility in the development of complex systems. The original design intention of the chip model 10AX027H2F34I2SG is to provide a reliable, cost-effective solution for a wide range of applications. It is also designed to be easily upgradable, allowing for the integration of new features and capabilities in the future.
The chip model 10AX027H2F34I2SG can be used in the development and popularization of future intelligent robots. Its high-performance and low-power design make it an ideal choice for applications such as autonomous navigation, object recognition, and voice recognition. With its advanced signal processing capabilities, it can be used to process data from a variety of sensors, allowing robots to react to their environment in real time.
In order to use the chip model 10AX027H2F34I2SG effectively, technical talents such as computer engineers, electrical engineers, and software engineers are needed. Computer engineers are needed to design the hardware and software components of the system. Electrical engineers are needed to design the circuits and power management systems. Software engineers are needed to develop the software that will be used to control the robot.
The chip model 10AX027H2F34I2SG is an excellent choice for a wide variety of applications, from digital signal processing to embedded processing and image processing. Its upgradability and compatibility with the HDL language makes it a great choice for future applications, such as the development and popularization of intelligent robots. In order to use the model effectively, technical talents such as computer engineers, electrical engineers, and software engineers are needed.
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4,358 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,314.1709 | $5,314.1709 |
| 10+ | $5,257.0293 | $52,570.2932 |
| 100+ | $4,971.3212 | $497,132.1201 |
| 1000+ | $4,685.6131 | $2,342,806.5430 |
| 10000+ | $4,285.6217 | $4,285,621.7250 |
| The price is for reference only, please refer to the actual quotation! | ||