Intel Corporation
10AX027H2F34E2LG
10AX027H2F34E2LG ECAD Model
10AX027H2F34E2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1152 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX027H2F34E2LG Datasheet Download
10AX027H2F34E2LG Overview
The chip model 10AX027H2F34E2LG is an advanced integrated circuit (IC) designed for use in a wide range of applications. It is a powerful and versatile chip that can be used in both consumer and industrial applications. This chip offers a wide range of features and benefits that make it an ideal choice for many applications.
The 10AX027H2F34E2LG chip model is designed to provide high performance, low power consumption, and a wide range of features and capabilities. It is designed to be compatible with a variety of industry standards, such as USB, Ethernet, and Wi-Fi. This chip is also designed to be highly reliable, with a long lifespan and a high level of reliability.
The 10AX027H2F34E2LG chip model is also designed to provide superior performance in a variety of scenarios. It is designed to be used in a variety of networks, including wireless networks, cellular networks, and wired networks. This chip is also designed to be compatible with a variety of intelligent systems, such as home automation systems, industrial automation systems, and robotics systems.
The 10AX027H2F34E2LG chip model is also designed to be highly efficient and cost-effective. It is designed to provide high performance at a low cost. This chip is also designed to be highly reliable, with a long lifespan and a high level of reliability. This chip is also designed to be highly compatible with a variety of industry standards, such as USB, Ethernet, and Wi-Fi.
The 10AX027H2F34E2LG chip model has a wide range of features and benefits that make it an ideal choice for many applications. It is designed to be highly reliable, with a long lifespan and a high level of reliability. This chip is also designed to be compatible with a variety of industry standards, such as USB, Ethernet, and Wi-Fi. This chip is also designed to be highly efficient and cost-effective.
The 10AX027H2F34E2LG chip model is expected to be in high demand in the future, as it is designed to be used in a variety of applications. It is expected to be used in a variety of networks, including wireless networks, cellular networks, and wired networks. This chip is also expected to be used in a variety of intelligent systems, such as home automation systems, industrial automation systems, and robotics systems.
The product description and specific design requirements of the 10AX027H2F34E2LG chip model are available in the product documentation. This document outlines the features and capabilities of the chip, as well as the design requirements for the chip. It also outlines the precautions that must be taken when using the chip.
Case studies of applications of the 10AX027H2F34E2LG chip model are available in the product documentation. These case studies offer insight into how the chip can be used in a variety of scenarios and applications. They also offer insight into the precautions that must be taken when using the chip.
In conclusion, the 10AX027H2F34E2LG chip model is an advanced IC designed for use in a wide range of applications. It is designed to provide high performance, low power consumption, and a wide range of features and capabilities. It is expected to be in high demand in the future, as it is designed to be used in a variety of networks and intelligent systems. The product description and design requirements of the chip are available in the product documentation, as well as case studies of applications of the chip.
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1,071 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,984.5793 | $4,984.5793 |
| 10+ | $4,930.9817 | $49,309.8168 |
| 100+ | $4,662.9935 | $466,299.3549 |
| 1000+ | $4,395.0054 | $2,197,502.7070 |
| 10000+ | $4,019.8220 | $4,019,822.0250 |
| The price is for reference only, please refer to the actual quotation! | ||