Intel Corporation
10AX027H1F34E1HG
10AX027H1F34E1HG ECAD Model
10AX027H1F34E1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 384 | |
| Number of Outputs | 384 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| JESD-30 Code | S-PBGA-B1152 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 1152 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| Length | 35 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-1152 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX027H1F34E1HG Datasheet Download
10AX027H1F34E1HG Overview
The chip model 10AX027H1F34E1HG is a state-of-the-art model that offers a number of advantages to its users. It is designed to be reliable, efficient and cost-effective, making it an ideal choice for a variety of industries. The chip is designed to be used in a wide range of applications, such as communication systems, networks, and intelligent scenarios.
The 10AX027H1F34E1HG provides a number of features that make it a desirable choice for many industries. It has a low power consumption, making it suitable for applications that require low energy consumption. Its high speed and low latency make it suitable for applications that require high-speed data processing. It also has a high level of reliability and is capable of handling large amounts of data.
The 10AX027H1F34E1HG is designed with future upgrades in mind. It is designed with the latest technology and is capable of being upgraded to meet the demands of the future. The chip is also designed to be compatible with advanced communication systems, such as 5G and Wi-Fi 6, making it suitable for a variety of applications.
The 10AX027H1F34E1HG is also designed to be used in networks and intelligent scenarios. It is capable of handling a variety of tasks, such as data processing and communication. It is also capable of being used in the era of fully intelligent systems, making it a desirable choice for many industries.
The 10AX027H1F34E1HG is an excellent choice for many industries due to its advantages and its potential for future upgrades. Its low power consumption, high speed, and low latency make it suitable for a variety of applications. It is also capable of being used in networks and intelligent scenarios, making it a desirable choice for many industries. The chip is also designed to be compatible with advanced communication systems, making it suitable for a variety of applications. With its potential for future upgrades, the 10AX027H1F34E1HG is expected to be in high demand in the future.
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1,637 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,242.4824 | $1,242.4824 |
| 10+ | $1,229.1224 | $12,291.2239 |
| 100+ | $1,162.3223 | $116,232.2262 |
| 1000+ | $1,095.5221 | $547,761.0660 |
| 10000+ | $1,002.0020 | $1,002,001.9500 |
| The price is for reference only, please refer to the actual quotation! | ||