Intel Corporation
10AX027E4F29I3SG
10AX027E4F29I3SG ECAD Model
10AX027E4F29I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027E4F29I3SG Datasheet Download
10AX027E4F29I3SG Overview
The chip model 10AX027E4F29I3SG is an innovative product from the semiconductor industry that is designed for use in high-performance digital signal processing, embedded processing, and image processing. It provides users with the ability to utilize HDL (Hardware Description Language) to perform various tasks. This chip model is a great choice for any application that requires high-performance processing.
The 10AX027E4F29I3SG has several advantages that make it an ideal choice for many industries. It is designed with a low-power consumption, making it more energy-efficient than other models. Additionally, it has a high-speed processing capability and is capable of handling multiple tasks simultaneously. This chip model also features a high-level of integration, allowing it to be used in various applications with ease.
The 10AX027E4F29I3SG is expected to be in high demand in the future due to its many advantages. Its low-power consumption and high-speed processing capabilities make it an ideal choice for high-performance digital signal processing, embedded processing, and image processing applications. Additionally, its high-level of integration allows it to be used in many different applications.
When designing the 10AX027E4F29I3SG, designers must consider the product's specific design requirements. This includes the power consumption, the number of tasks it can handle, the level of integration, and the speed of processing. Additionally, designers must be aware of the possible risks associated with this chip model, such as the potential for data corruption and the possibility of errors occurring during the design process.
In order to ensure the successful implementation of the 10AX027E4F29I3SG, designers should consider actual case studies and take the necessary precautions. For example, designers should use the HDL language to create the design, as this will help to ensure that the design is accurate and that no errors occur during the design process. Additionally, designers should ensure that the power consumption is kept to a minimum and that the chip model is tested thoroughly before it is implemented.
The 10AX027E4F29I3SG is an innovative chip model from the semiconductor industry that is designed for use in high-performance digital signal processing, embedded processing, and image processing applications. It provides users with the ability to utilize HDL (Hardware Description Language) to perform various tasks. This chip model has several advantages that make it an ideal choice for many industries, including its low-power consumption and high-speed processing capabilities. When designing the 10AX027E4F29I3SG, designers must consider the product's specific design requirements and take the necessary precautions to ensure the successful implementation of the chip model. With its many advantages and expected high demand in the future, the 10AX027E4F29I3SG is sure to be a popular choice in the semiconductor industry.
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5,486 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,667.3986 | $2,667.3986 |
| 10+ | $2,638.7169 | $26,387.1686 |
| 100+ | $2,495.3083 | $249,530.8335 |
| 1000+ | $2,351.8998 | $1,175,949.9050 |
| 10000+ | $2,151.1279 | $2,151,127.8750 |
| The price is for reference only, please refer to the actual quotation! | ||