
Intel Corporation
10AX027E4F29E3SG
10AX027E4F29E3SG ECAD Model
10AX027E4F29E3SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 270000 | |
Number of CLBs | 10162 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 10162 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA784,28X28,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
10AX027E4F29E3SG Datasheet Download
10AX027E4F29E3SG Overview
The chip model 10AX027E4F29E3SG is an advanced integrated circuit system that has been designed to meet the needs of a wide range of industries. This model is a powerful tool that can be applied to a variety of applications, such as telecommunications, automotive, and consumer electronics. The chip model 10AX027E4F29E3SG has been designed with the goal of providing a high level of performance and reliability to its users.
The 10AX027E4F29E3SG is a highly efficient chip model that offers a number of advantages to its users. This chip model is capable of providing a high level of performance and reliability, while also offering a low power consumption. It also offers a high level of integration, allowing for the integration of multiple components into a single chip. Additionally, this chip model is designed to be highly flexible, allowing for the integration of different technologies and components into a single chip.
The 10AX027E4F29E3SG is expected to see increasing demand in the coming years as more industries look to utilize its capabilities. This chip model is expected to be used in a variety of applications, including automotive, telecommunications, and consumer electronics. Additionally, this chip model is expected to be used in the development and popularization of future intelligent robots, as its features make it an ideal tool for this purpose.
The original design intention of the 10AX027E4F29E3SG was to provide a high level of performance and reliability, while also offering a low power consumption. Additionally, the chip model was designed to be highly flexible, allowing for the integration of different technologies and components into a single chip. This chip model is also capable of being upgraded to meet the demands of future applications, making it a great choice for those who are looking to use it in the development of advanced communication systems.
In order to use the 10AX027E4F29E3SG effectively, it is important to have the right technical skills. This chip model requires a certain level of knowledge in order to be used correctly, as it is a highly advanced system. Those who are looking to use this chip model should have an understanding of electrical engineering and computer programming, as well as a good understanding of the principles of chip design. Additionally, those who are looking to use this chip model should have a good working knowledge of the various technologies and components used in the design of the chip.
The 10AX027E4F29E3SG is a powerful and efficient chip model that offers a number of advantages to its users. This chip model is expected to be used in a variety of applications, including automotive, telecommunications, and consumer electronics. Additionally, this chip model is expected to be used in the development and popularization of future intelligent robots, as its features make it an ideal tool for this purpose. In order to use this chip model effectively, it is important to have the right technical skills, as it is a highly advanced system. With the right technical skills, the 10AX027E4F29E3SG can be used to its fullest potential and can help to facilitate the development and popularization of advanced communication systems and intelligent robots.
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2,956 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $508.8985 | $508.8985 |
10+ | $503.4265 | $5,034.2648 |
100+ | $476.0663 | $47,606.6349 |
1000+ | $448.7062 | $224,353.1070 |
10000+ | $410.4020 | $410,402.0250 |
The price is for reference only, please refer to the actual quotation! |