10AX027E4F29E3LG
10AX027E4F29E3LG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX027E4F29E3LG


10AX027E4F29E3LG
F18-10AX027E4F29E3LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA784,28X28,40
BGA, BGA784,28X28,40

10AX027E4F29E3LG ECAD Model


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10AX027E4F29E3LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 360
Number of Outputs 360
Number of Logic Cells 270000
Number of CLBs 10162
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 10162 CLBS
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA784,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AX027E4F29E3LG Datasheet Download


10AX027E4F29E3LG Overview



The chip model 10AX027E4F29E3LG is a high-performance chip model designed for a variety of applications, including digital signal processing, embedded processing, image processing, and more. It is designed to be programmed using HDL language, allowing developers to create powerful and high-performance applications.


The 10AX027E4F29E3LG chip model provides several advantages over other models. It is designed to be powerful and efficient, allowing developers to create applications that can handle a wide range of tasks. It also has a low power consumption rate, making it suitable for applications that require low power usage. Additionally, the chip model has a wide range of features, including a large number of on-chip peripherals and a variety of memory types.


The 10AX027E4F29E3LG chip model is expected to be in high demand in the coming years. As the development of digital signal processing, embedded processing, and image processing technologies continues, the 10AX027E4F29E3LG chip model is expected to be increasingly used in these fields. Additionally, the chip model is expected to be used in the development of new and innovative applications, such as intelligent robots, as the technology continues to advance.


The 10AX027E4F29E3LG chip model can be used in the development and popularization of future intelligent robots. However, it is important to note that the use of this chip model requires the use of HDL language. Therefore, developers who wish to use the chip model effectively must have a good understanding of HDL language and be able to use it to create powerful and efficient applications. Additionally, developers must also have a good understanding of the chip model itself, as well as the various features and peripherals that it offers. With these skills, developers can create powerful and innovative applications using the 10AX027E4F29E3LG chip model.



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Unit Price: $3,414.1268
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,175.1379 $3,175.1379
10+ $3,140.9967 $31,409.9666
100+ $2,970.2903 $297,029.0316
1000+ $2,799.5840 $1,399,791.9880
10000+ $2,560.5951 $2,560,595.1000
The price is for reference only, please refer to the actual quotation!

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