
Intel Corporation
10AX027E4F29E3LG
10AX027E4F29E3LG ECAD Model
10AX027E4F29E3LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 360 | |
Number of Outputs | 360 | |
Number of Logic Cells | 270000 | |
Number of CLBs | 10162 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 10162 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA784,28X28,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
10AX027E4F29E3LG Datasheet Download
10AX027E4F29E3LG Overview
The chip model 10AX027E4F29E3LG is a high-performance chip model designed for a variety of applications, including digital signal processing, embedded processing, image processing, and more. It is designed to be programmed using HDL language, allowing developers to create powerful and high-performance applications.
The 10AX027E4F29E3LG chip model provides several advantages over other models. It is designed to be powerful and efficient, allowing developers to create applications that can handle a wide range of tasks. It also has a low power consumption rate, making it suitable for applications that require low power usage. Additionally, the chip model has a wide range of features, including a large number of on-chip peripherals and a variety of memory types.
The 10AX027E4F29E3LG chip model is expected to be in high demand in the coming years. As the development of digital signal processing, embedded processing, and image processing technologies continues, the 10AX027E4F29E3LG chip model is expected to be increasingly used in these fields. Additionally, the chip model is expected to be used in the development of new and innovative applications, such as intelligent robots, as the technology continues to advance.
The 10AX027E4F29E3LG chip model can be used in the development and popularization of future intelligent robots. However, it is important to note that the use of this chip model requires the use of HDL language. Therefore, developers who wish to use the chip model effectively must have a good understanding of HDL language and be able to use it to create powerful and efficient applications. Additionally, developers must also have a good understanding of the chip model itself, as well as the various features and peripherals that it offers. With these skills, developers can create powerful and innovative applications using the 10AX027E4F29E3LG chip model.
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3,496 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,175.1379 | $3,175.1379 |
10+ | $3,140.9967 | $31,409.9666 |
100+ | $2,970.2903 | $297,029.0316 |
1000+ | $2,799.5840 | $1,399,791.9880 |
10000+ | $2,560.5951 | $2,560,595.1000 |
The price is for reference only, please refer to the actual quotation! |