10AX027E4F27I3SG
10AX027E4F27I3SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX027E4F27I3SG


10AX027E4F27I3SG
F18-10AX027E4F27I3SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA672,26X26,40
BGA, BGA672,26X26,40

10AX027E4F27I3SG ECAD Model


Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

10AX027E4F27I3SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 270000
Number of CLBs 10162
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 10162 CLBS
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AX027E4F27I3SG Datasheet Download


10AX027E4F27I3SG Overview



The chip model 10AX027E4F27I3SG is a high-performance, low-power FPGA chip from Intel's Altera series. It is suitable for a wide range of applications such as high-performance digital signal processing, embedded processing, and image processing, and requires the use of HDL language. This chip model is one of the most advanced FPGA chips available on the market and it has several advantages over other chips.


First and foremost, the 10AX027E4F27I3SG chip model has a high-performance architecture that provides excellent performance and power efficiency. It also features a large number of I/O pins, making it suitable for a wide range of applications. In addition, this chip model also supports a wide range of high-speed interfaces, including USB 3.0, PCIe, and Ethernet. This makes it suitable for a variety of applications, such as high-performance digital signal processing, embedded processing, and image processing.


The 10AX027E4F27I3SG chip model is expected to be in high demand in the future due to its high performance, low power consumption, and wide range of applications. In particular, this model is expected to be used in the development of networks and intelligent systems. With its high-performance architecture and wide range of I/O pins, this model is ideal for the development of networks and intelligent systems. It can be used to build intelligent systems that are capable of handling large amounts of data, as well as providing intelligent services such as natural language processing and machine learning.


The 10AX027E4F27I3SG chip model is also expected to be used in the era of fully intelligent systems. This model is capable of handling large amounts of data, as well as providing intelligent services such as natural language processing and machine learning. This chip model is capable of providing the necessary computing power for the development of fully intelligent systems. In addition, this model is also expected to be used in the development of autonomous vehicles and robots, as well as in the development of artificial intelligence and machine learning systems.


Overall, the 10AX027E4F27I3SG chip model is an ideal choice for a wide range of applications, including high-performance digital signal processing, embedded processing, image processing, and the development of networks and intelligent systems. This model is expected to be in high demand in the future due to its high performance, low power consumption, and wide range of applications. It is also expected to be used in the development of fully intelligent systems, as well as in the development of autonomous vehicles and robots.



2,730 In Stock


I want to buy

Unit Price: $2,515.3365
The price is for reference only.
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
1+ $2,339.2629 $2,339.2629
10+ $2,314.1096 $23,141.0958
100+ $2,188.3428 $218,834.2755
1000+ $2,062.5759 $1,031,287.9650
10000+ $1,886.5024 $1,886,502.3750
The price is for reference only, please refer to the actual quotation!

Quick Quote