Intel Corporation
10AX027E3F29I2SG
10AX027E3F29I2SG ECAD Model
10AX027E3F29I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX027E3F29I2SG Datasheet Download
10AX027E3F29I2SG Overview
The chip model 10AX027E3F29I2SG is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It requires the use of HDL language to enable the chip to perform complex operations with minimal power consumption. This chip model is designed to meet the ever-increasing demand for higher processing power and greater efficiency in the digital signal processing, embedded processing, and image processing industries.
The chip model 10AX027E3F29I2SG is designed to be a highly versatile and powerful chip for a wide range of applications. It is able to handle complex operations with minimal power consumption, allowing for efficient and cost-effective operations. It is also designed with future upgrades in mind, allowing for easy and fast upgrades to keep up with the ever-changing technology landscape.
The chip model 10AX027E3F29I2SG is designed to be used in a wide range of industries and applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. It is also capable of being used in advanced communication systems, allowing for high-speed and reliable communication.
The chip model 10AX027E3F29I2SG is designed to be highly versatile and powerful. It is capable of handling complex operations with minimal power consumption, allowing for efficient and cost-effective operations. It is also designed with future upgrades in mind, allowing for easy and fast upgrades to keep up with the ever-changing technology landscape.
In terms of industry trends, the chip model 10AX027E3F29I2SG is designed to be highly versatile and powerful, allowing for efficient and cost-effective operations. It is also designed with future upgrades in mind, allowing for easy and fast upgrades to keep up with the ever-changing technology landscape. As for the application environment, it will depend on what specific technologies are needed for the application.
The original design intention of the chip model 10AX027E3F29I2SG is to provide a highly versatile and powerful chip for a wide range of applications. It is capable of handling complex operations with minimal power consumption, allowing for efficient and cost-effective operations. It is also designed with future upgrades in mind, allowing for easy and fast upgrades to keep up with the ever-changing technology landscape.
In conclusion, the chip model 10AX027E3F29I2SG is a high-performance chip designed for digital signal processing, embedded processing, and image processing. It is capable of handling complex operations with minimal power consumption, allowing for efficient and cost-effective operations. It is also designed with future upgrades in mind, allowing for easy and fast upgrades to keep up with the ever-changing technology landscape. It is suitable for a wide range of industries and applications, and can be used in advanced communication systems.
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5,887 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,421.6428 | $3,421.6428 |
| 10+ | $3,384.8509 | $33,848.5094 |
| 100+ | $3,200.8916 | $320,089.1646 |
| 1000+ | $3,016.9324 | $1,508,466.1780 |
| 10000+ | $2,759.3894 | $2,759,389.3500 |
| The price is for reference only, please refer to the actual quotation! | ||