Intel Corporation
10AX027E3F29E2SG
10AX027E3F29E2SG ECAD Model
10AX027E3F29E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027E3F29E2SG Datasheet Download
10AX027E3F29E2SG Overview
The chip model 10AX027E3F29E2SG is a powerful and versatile chip that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The chip is capable of handling complex tasks and is suitable for a wide range of applications.
The industry trends of the chip model 10AX027E3F29E2SG and the future development of related industries depend on what specific technologies are needed. New technologies are constantly being developed and the chip model 10AX027E3F29E2SG could be used to power them. For example, the chip could be used in networks to enable faster and more efficient data transfer, or in the era of fully intelligent systems to enable smarter, more efficient decision-making.
The chip model 10AX027E3F29E2SG could also be used in a variety of intelligent scenarios. For example, it could be used in autonomous vehicles, to enable faster and more efficient decision-making, or in smart homes, to enable automated tasks such as controlling lighting and temperature. In addition, the chip could be used in a variety of other intelligent scenarios, such as robotics, virtual reality, and artificial intelligence.
The chip model 10AX027E3F29E2SG is a powerful and versatile chip that is suitable for a variety of applications. It is designed for high-performance digital signal processing, embedded processing, image processing, and other applications that require the use of HDL language. The chip is capable of handling complex tasks and is suitable for a wide range of applications. The industry trends of the chip model 10AX027E3F29E2SG and the future development of related industries depend on what specific technologies are needed, and the chip could be used to power them. The chip could also be used in a variety of intelligent scenarios, from autonomous vehicles to smart homes and robotics. As new technologies are developed, the possibilities for the chip model 10AX027E3F29E2SG are endless.
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3,883 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,933.8115 | $2,933.8115 |
| 10+ | $2,902.2651 | $29,022.6512 |
| 100+ | $2,744.5333 | $274,453.3320 |
| 1000+ | $2,586.8015 | $1,293,400.7600 |
| 10000+ | $2,365.9770 | $2,365,977.0000 |
| The price is for reference only, please refer to the actual quotation! | ||