Intel Corporation
10AX027E3F27I2LG
10AX027E3F27I2LG ECAD Model
10AX027E3F27I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027E3F27I2LG Datasheet Download
10AX027E3F27I2LG Overview
The chip model 10AX027E3F27I2LG is a powerful and versatile integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, and image processing applications. It is equipped with a range of features, including an on-chip memory, a high-speed processor, and an on-chip debug module. It is also capable of supporting multiple interfaces, such as Ethernet, USB, and CAN.
The 10AX027E3F27I2LG is designed to be programmed using the HDL (Hardware Description Language) language. This language allows designers to create complex systems with a high level of precision and control. The HDL language is also used to create test benches and to verify the functionality of the system.
The 10AX027E3F27I2LG has been designed for use in a variety of industries, including automotive, industrial, aerospace, and medical. It is also suitable for use in consumer electronics applications. Its wide range of features make it a versatile and powerful IC for a variety of applications.
The 10AX027E3F27I2LG is an excellent choice for anyone looking for a reliable and powerful IC for their project. When designing with the 10AX027E3F27I2LG, it is important to consider the specific design requirements for the application. This includes the selection of the correct memory, processor, and debug module, as well as the design of the appropriate interfaces. Additionally, it is important to consider the industry trends and future development of related industries in order to ensure the application environment will be supported by the necessary technologies.
In order to ensure the successful implementation of the 10AX027E3F27I2LG, it is important to take into account the product description and design requirements. Additionally, it is beneficial to review actual case studies and take any necessary precautions. With the right combination of design considerations and precautions, the 10AX027E3F27I2LG can be used to create powerful and reliable systems for a variety of applications.
You May Also Be Interested In
2,993 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,752.5399 | $3,752.5399 |
| 10+ | $3,712.1900 | $37,121.8997 |
| 100+ | $3,510.4405 | $351,044.0517 |
| 1000+ | $3,308.6911 | $1,654,345.5310 |
| 10000+ | $3,026.2418 | $3,026,241.8250 |
| The price is for reference only, please refer to the actual quotation! | ||