Intel Corporation
10AX027E2F29I1HG
10AX027E2F29I1HG ECAD Model
10AX027E2F29I1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027E2F29I1HG Datasheet Download
10AX027E2F29I1HG Overview
The chip model 10AX027E2F29I1HG is a powerful and versatile digital signal processing unit that is suitable for a wide range of applications. It is designed for high-performance digital signal processing, embedded processing, and image processing, and requires the use of HDL language. This chip model is the perfect choice for those looking for a reliable and efficient solution for their processing needs.
The chip model 10AX027E2F29I1HG is designed to be highly efficient and reliable, while also providing the flexibility to meet a variety of application requirements. It has a wide range of features, including a high-speed processor, an extensive memory system, and a variety of communication protocols. These features make the chip model 10AX027E2F29I1HG an ideal choice for applications that require high-performance digital signal processing, embedded processing, and image processing.
The industry trends for the chip model 10AX027E2F29I1HG are constantly evolving, and the future of related industries will depend on the specific technologies that are needed. The product description and specific design requirements of the chip model 10AX027E2F29I1HG, along with actual case studies and precautions, can help guide the development of related industries.
The chip model 10AX027E2F29I1HG is an excellent choice for those looking for an efficient and reliable solution for their processing needs. It is designed to meet a variety of application requirements, including high-speed processing, an extensive memory system, and a variety of communication protocols. With its wide range of features, the chip model 10AX027E2F29I1HG is an ideal choice for applications that require high-performance digital signal processing, embedded processing, and image processing. The industry trends and future development of related industries will depend on the specific technologies that are needed, and the product description and design requirements of the chip model 10AX027E2F29I1HG, along with actual case studies and precautions, can help guide the development of related industries.
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3,015 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,265.8987 | $4,265.8987 |
| 10+ | $4,220.0288 | $42,200.2878 |
| 100+ | $3,990.6794 | $399,067.9386 |
| 1000+ | $3,761.3300 | $1,880,664.9980 |
| 10000+ | $3,440.2409 | $3,440,240.8500 |
| The price is for reference only, please refer to the actual quotation! | ||