Intel Corporation
10AX027E2F29E1HG
10AX027E2F29E1HG ECAD Model
10AX027E2F29E1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 360 | |
| Number of Outputs | 360 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027E2F29E1HG Datasheet Download
10AX027E2F29E1HG Overview
The chip model 10AX027E2F29E1HG is a powerful, high-performance chip that is suitable for a variety of applications, including digital signal processing, embedded processing, and image processing. It is capable of performing complex tasks quickly and efficiently, making it an ideal choice for these types of applications. The chip model requires the use of HDL language, which is a specialized language designed specifically for digital systems.
The chip model 10AX027E2F29E1HG offers several advantages over other models. It is capable of high-speed data processing, and its low power consumption makes it an energy-efficient choice. Additionally, the chip model is designed to be reliable and durable, making it a cost-effective option for long-term use. As technology continues to advance, the demand for this chip model is expected to increase in related industries.
The chip model 10AX027E2F29E1HG can be used in networks, allowing for fast and reliable data transmission. It can also be used in intelligent scenarios, such as facial recognition, object detection, and voice recognition. As technology continues to evolve, this chip model will become even more powerful and capable of handling more complex tasks. In the future, it is possible that this chip model could be used in fully intelligent systems, such as autonomous vehicles and robotic systems.
Overall, the chip model 10AX027E2F29E1HG is a powerful and reliable chip model that is suitable for a variety of applications. It is capable of high-speed data processing and low power consumption, making it an energy-efficient choice. Additionally, the chip model is designed to be reliable and durable, making it a cost-effective option for long-term use. As technology continues to advance, the demand for this chip model is expected to increase in related industries. It can be used in networks for fast and reliable data transmission and in intelligent scenarios, such as facial recognition, object detection, and voice recognition. In the future, it is possible that this chip model could be used in fully intelligent systems.
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2,011 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,266.6604 | $4,266.6604 |
| 10+ | $4,220.7823 | $42,207.8235 |
| 100+ | $3,991.3920 | $399,139.2003 |
| 1000+ | $3,762.0017 | $1,881,000.8290 |
| 10000+ | $3,440.8552 | $3,440,855.1750 |
| The price is for reference only, please refer to the actual quotation! | ||