Intel Corporation
10AX027E2F27I2SG
10AX027E2F27I2SG ECAD Model
10AX027E2F27I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991 | |
| HTS Code | 8542.39.00.01 |
10AX027E2F27I2SG Datasheet Download
10AX027E2F27I2SG Overview
The chip model 10AX027E2F27I2SG is a powerful digital signal processor that is suitable for high-performance digital signal processing, embedded processing, image processing, and other related applications. It requires the use of HDL language, which is a hardware description language that is used to create digital designs. This chip model has several advantages that make it a great choice for many applications.
The 10AX027E2F27I2SG chip model is designed to be highly efficient and reliable. It has a low power consumption and a high processing speed, making it ideal for applications that require fast and accurate results. Additionally, the chip model is designed with a large memory capacity, allowing for larger data sets to be processed. This makes it ideal for high-performance applications that require large amounts of data.
The 10AX027E2F27I2SG chip model is also designed with a wide range of features, including support for multiple operating systems, a wide range of peripherals, and a wide range of communication protocols. This makes it ideal for applications that require a variety of features and capabilities. These features make the 10AX027E2F27I2SG chip model a great choice for many industries, including industrial automation, automotive, medical, and consumer electronics.
The demand for the 10AX027E2F27I2SG chip model is expected to continue to grow in the future, as the need for efficient and reliable digital signal processing increases. This chip model is also a great choice for the development and popularization of future intelligent robots, as it is designed to be highly efficient and reliable. To use the 10AX027E2F27I2SG chip model effectively, technical talents with knowledge of HDL language are needed. Additionally, knowledge of digital signal processing and embedded processing is also important. With the right skills and knowledge, the 10AX027E2F27I2SG chip model can be used to create powerful and reliable intelligent robots.
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1,830 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,274.9515 | $3,274.9515 |
| 10+ | $3,239.7369 | $32,397.3694 |
| 100+ | $3,063.6643 | $306,366.4284 |
| 1000+ | $2,887.5916 | $1,443,795.8120 |
| 10000+ | $2,641.0899 | $2,641,089.9000 |
| The price is for reference only, please refer to the actual quotation! | ||