
Intel Corporation
10AX027E2F27E1HG
10AX027E2F27E1HG ECAD Model
10AX027E2F27E1HG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 270000 | |
Number of CLBs | 10162 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 10162 CLBS | |
JESD-30 Code | S-PBGA-B672 | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-672 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
ECCN Code | 3A991 |
10AX027E2F27E1HG Datasheet Download
10AX027E2F27E1HG Overview
The chip model 10AX027E2F27E1HG is a highly advanced, high-performance integrated circuit (IC) designed for digital signal processing, embedded processing, and image processing. This chip model is equipped with a range of features such as high-speed operation, low power consumption, and the ability to support a wide range of communication protocols. Furthermore, this chip model requires the use of the hardware description language (HDL) for programming, allowing for the development of complex applications.
The 10AX027E2F27E1HG chip model is suitable for applications that require high-performance digital signal processing, embedded processing, and image processing. This model is designed to offer enhanced performance and efficiency compared to other models, making it an ideal choice for those who require a powerful and reliable chip. Additionally, this chip model is capable of supporting a wide range of communication protocols, allowing for the development of complex applications.
When using the 10AX027E2F27E1HG chip model, it is important to consider the product description and specific design requirements of the chip model. This includes understanding the features and capabilities of the chip, as well as the HDL programming language used to develop applications. Additionally, it is important to understand the actual case studies and precautions associated with the chip model. This includes understanding the potential risks and hazards associated with the use of the chip, as well as any potential limitations of the chip model.
The 10AX027E2F27E1HG chip model can be applied to the development and popularization of future intelligent robots. This chip model is capable of supporting a wide range of communication protocols, allowing for the development of complex applications. Additionally, this chip model is designed to offer enhanced performance and efficiency compared to other models, making it an ideal choice for those who require a powerful and reliable chip. In order to use the 10AX027E2F27E1HG chip model effectively, technical talents such as software engineers, electrical engineers, and computer scientists are needed. These experts must be knowledgeable in the HDL programming language, as well as the features and capabilities of the chip model. Furthermore, they must be aware of the actual case studies and precautions associated with the chip model, as well as the potential risks and hazards associated with its use.
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3,333 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $3,274.9515 | $3,274.9515 |
10+ | $3,239.7369 | $32,397.3694 |
100+ | $3,063.6643 | $306,366.4284 |
1000+ | $2,887.5916 | $1,443,795.8120 |
10000+ | $2,641.0899 | $2,641,089.9000 |
The price is for reference only, please refer to the actual quotation! |