10AX027E2F27E1HG
10AX027E2F27E1HG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX027E2F27E1HG


10AX027E2F27E1HG
F18-10AX027E2F27E1HG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, FBGA-672
FBGA-672

10AX027E2F27E1HG ECAD Model


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10AX027E2F27E1HG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 270000
Number of CLBs 10162
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 10162 CLBS
JESD-30 Code S-PBGA-B672
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-672
Reach Compliance Code compliant
HTS Code 8542.39.00.01
ECCN Code 3A991

10AX027E2F27E1HG Datasheet Download


10AX027E2F27E1HG Overview



The chip model 10AX027E2F27E1HG is a highly advanced, high-performance integrated circuit (IC) designed for digital signal processing, embedded processing, and image processing. This chip model is equipped with a range of features such as high-speed operation, low power consumption, and the ability to support a wide range of communication protocols. Furthermore, this chip model requires the use of the hardware description language (HDL) for programming, allowing for the development of complex applications.


The 10AX027E2F27E1HG chip model is suitable for applications that require high-performance digital signal processing, embedded processing, and image processing. This model is designed to offer enhanced performance and efficiency compared to other models, making it an ideal choice for those who require a powerful and reliable chip. Additionally, this chip model is capable of supporting a wide range of communication protocols, allowing for the development of complex applications.


When using the 10AX027E2F27E1HG chip model, it is important to consider the product description and specific design requirements of the chip model. This includes understanding the features and capabilities of the chip, as well as the HDL programming language used to develop applications. Additionally, it is important to understand the actual case studies and precautions associated with the chip model. This includes understanding the potential risks and hazards associated with the use of the chip, as well as any potential limitations of the chip model.


The 10AX027E2F27E1HG chip model can be applied to the development and popularization of future intelligent robots. This chip model is capable of supporting a wide range of communication protocols, allowing for the development of complex applications. Additionally, this chip model is designed to offer enhanced performance and efficiency compared to other models, making it an ideal choice for those who require a powerful and reliable chip. In order to use the 10AX027E2F27E1HG chip model effectively, technical talents such as software engineers, electrical engineers, and computer scientists are needed. These experts must be knowledgeable in the HDL programming language, as well as the features and capabilities of the chip model. Furthermore, they must be aware of the actual case studies and precautions associated with the chip model, as well as the potential risks and hazards associated with its use.



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Unit Price: $3,521.4532
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Pricing (USD)

QTY Unit Price Ext Price
1+ $3,274.9515 $3,274.9515
10+ $3,239.7369 $32,397.3694
100+ $3,063.6643 $306,366.4284
1000+ $2,887.5916 $1,443,795.8120
10000+ $2,641.0899 $2,641,089.9000
The price is for reference only, please refer to the actual quotation!

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