Intel Corporation
10AX027E1F27I1HG
10AX027E1F27I1HG ECAD Model
10AX027E1F27I1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 270000 | |
| Number of CLBs | 10162 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 10162 CLBS | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991 |
10AX027E1F27I1HG Datasheet Download
10AX027E1F27I1HG Overview
The chip model 10AX027E1F27I1HG was designed with the intention of providing a powerful and cost-effective solution for communication systems. It is a highly integrated, high-performance chip that is capable of providing a wide range of services including data transmission, storage, and processing. It is also capable of supporting advanced communication systems, such as 5G and LTE, and can be used to develop a variety of applications.
The chip model 10AX027E1F27I1HG can be used in a variety of network scenarios, including wireless networks, wired networks, and networks of connected devices. It can also be used in intelligent scenarios, such as autonomous driving, facial recognition, and natural language processing. With its powerful processing capabilities, it can be used to develop and popularize future intelligent robots.
In order to effectively use the chip model 10AX027E1F27I1HG, it is necessary to have a good understanding of the various technologies and protocols associated with communication systems. This includes a knowledge of hardware and software design, as well as a good understanding of the various communication protocols. Furthermore, it is important to have a good understanding of the various algorithms and data structures that are used in the development of intelligent systems.
The chip model 10AX027E1F27I1HG is a powerful and cost-effective solution for communication systems and can be used in a variety of scenarios. It is capable of supporting advanced communication systems, such as 5G and LTE, and can be used to develop a variety of applications. Furthermore, it can be used in intelligent scenarios, such as autonomous driving, facial recognition, and natural language processing. With its powerful processing capabilities, it can be used to develop and popularize future intelligent robots. In order to effectively use the chip model 10AX027E1F27I1HG, it is necessary to have a good understanding of the various technologies and protocols associated with communication systems.
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1,016 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $4,991.0866 | $4,991.0866 |
| 10+ | $4,937.4190 | $49,374.1902 |
| 100+ | $4,669.0810 | $466,908.1026 |
| 1000+ | $4,400.7430 | $2,200,371.5180 |
| 10000+ | $4,025.0699 | $4,025,069.8500 |
| The price is for reference only, please refer to the actual quotation! | ||