Intel Corporation
10AX022E4F29I3SG
10AX022E4F29I3SG ECAD Model
10AX022E4F29I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E4F29I3SG Datasheet Download
10AX022E4F29I3SG Overview
The chip model 10AX022E4F29I3SG is a powerful and versatile integrated circuit that has a wide range of applications. It is suitable for high-performance digital signal processing, embedded processing, image processing, and other related industries. The chip model 10AX022E4F29I3SG utilizes the HDL language to ensure its efficient operation.
In terms of industry trends, the chip model 10AX022E4F29I3SG has seen a surge in demand due to its versatile applications. As technology advances, more and more industries are looking to utilize the chip model 10AX022E4F29I3SG in their operations. This includes the development of new technologies and the use of the chip model 10AX022E4F29I3SG in networks and intelligent scenarios.
The chip model 10AX022E4F29I3SG is capable of handling a wide range of tasks and is well-suited for the era of fully intelligent systems. It is capable of providing reliable and accurate results in a short amount of time. It is also capable of handling complex tasks, such as image processing, with ease. The chip model 10AX022E4F29I3SG is also capable of handling data transmission and communication between different systems.
The chip model 10AX022E4F29I3SG is a powerful and reliable integrated circuit that is capable of handling a wide range of tasks. It is well-suited for high-performance digital signal processing, embedded processing, image processing, networks, and other related industries. As technology advances, the chip model 10AX022E4F29I3SG is becoming more and more popular due to its versatility and reliability. It is capable of providing reliable results in a short amount of time and is well-suited for the era of fully intelligent systems.
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5,908 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $452.3520 | $452.3520 |
| 10+ | $447.4880 | $4,474.8800 |
| 100+ | $423.1680 | $42,316.8000 |
| 1000+ | $398.8480 | $199,424.0000 |
| 10000+ | $364.8000 | $364,800.0000 |
| The price is for reference only, please refer to the actual quotation! | ||