Intel Corporation
10AX022E4F29I3LG
10AX022E4F29I3LG ECAD Model
10AX022E4F29I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E4F29I3LG Datasheet Download
10AX022E4F29I3LG Overview
The chip model 10AX022E4F29I3LG is a new type of chip that has been developed to provide advanced capabilities for communication systems. It is designed to provide a powerful platform for communication systems and is expected to become increasingly popular in the near future. This chip model has a number of advantages over other chip models, including its high performance, low power consumption, and low cost.
The 10AX022E4F29I3LG chip model has been designed with the intention of providing a powerful platform for advanced communication systems. It is capable of providing high-speed data transmission, low latency, and reliable performance. The chip model is also designed to be easily upgradable, allowing it to be used in the future for more advanced communication systems. Additionally, the chip model is designed to be compatible with various types of networks, making it suitable for a wide range of applications.
The 10AX022E4F29I3LG chip model is expected to be increasingly popular in the near future, as it provides a powerful platform for communication systems. It is expected to be used in a variety of applications, such as in networks, intelligent scenarios, and even in the era of fully intelligent systems. Furthermore, the chip model is expected to be used in a variety of communication systems, such as in wireless networks, cellular networks, and satellite networks.
The 10AX022E4F29I3LG chip model is an exciting development in the world of communication systems. It is designed to provide a powerful platform for communication systems, while also being easily upgradable and compatible with various types of networks. It is expected to be increasingly popular in the near future, as it provides a powerful platform for communication systems and is expected to be used in a variety of applications. This chip model is an exciting development in the world of communication systems and is expected to be increasingly popular in the near future.
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2,141 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,469.3736 | $2,469.3736 |
| 10+ | $2,442.8212 | $24,428.2117 |
| 100+ | $2,310.0591 | $231,005.9148 |
| 1000+ | $2,177.2971 | $1,088,648.5640 |
| 10000+ | $1,991.4303 | $1,991,430.3000 |
| The price is for reference only, please refer to the actual quotation! | ||