Intel Corporation
10AX022E4F29E3LG
10AX022E4F29E3LG ECAD Model
10AX022E4F29E3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E4F29E3LG Datasheet Download
10AX022E4F29E3LG Overview
The chip model 10AX022E4F29E3LG is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing applications. It is designed to be used with HDL language, which is a specialized language for hardware design. The original design intention of the chip model 10AX022E4F29E3LG was to provide a powerful and reliable tool for digital signal processing, embedded processing, and image processing.
The chip model 10AX022E4F29E3LG has the potential to be upgraded in the future, allowing it to be used in a variety of applications. It is possible that the chip model 10AX022E4F29E3LG could be used in advanced communication systems, such as 5G networks. It may also be applied to intelligent scenarios, such as autonomous driving, intelligent home appliances, and smart cities. In the era of fully intelligent systems, the chip model 10AX022E4F29E3LG could be used to enhance the performance and reliability of a wide range of applications.
The chip model 10AX022E4F29E3LG is a powerful and reliable integrated circuit that can be used in a variety of applications. It has the potential to be upgraded in the future, allowing it to be used in advanced communication systems and intelligent scenarios. In the era of fully intelligent systems, the chip model 10AX022E4F29E3LG could be used to enhance the performance and reliability of a wide range of applications.
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5,965 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,060.1281 | $2,060.1281 |
| 10+ | $2,037.9762 | $20,379.7618 |
| 100+ | $1,927.2166 | $192,721.6605 |
| 1000+ | $1,816.4570 | $908,228.5150 |
| 10000+ | $1,661.3936 | $1,661,393.6250 |
| The price is for reference only, please refer to the actual quotation! | ||