Intel Corporation
10AX022E4F27I3SG
10AX022E4F27I3SG ECAD Model
10AX022E4F27I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E4F27I3SG Datasheet Download
10AX022E4F27I3SG Overview
The chip model 10AX022E4F27I3SG is a new model developed by Intel, and it is designed to provide reliable and efficient computing power for advanced communication systems. It is equipped with an advanced processor and a high-speed memory, which can provide high-speed data transmission and storage. With its powerful computing ability, it can be applied to a variety of complex network applications, such as network security, network optimization, network control, and network management.
The 10AX022E4F27I3SG chip model is also suitable for the development of intelligent systems. It is equipped with a powerful processor and a large memory, which can support the development of intelligent systems. It can be used in the development of intelligent robots, which can be used to perform complex tasks in various environments. It can also be used in the development of intelligent systems, which can help to improve the efficiency and accuracy of decision-making.
The 10AX022E4F27I3SG chip model is also suitable for the development of future intelligent systems. With its powerful computing ability, it can be used to develop intelligent systems that can process large amounts of data and make decisions quickly and accurately. It can also be used to develop intelligent systems that can interact with humans and other machines.
In order to effectively use the 10AX022E4F27I3SG chip model, technical talents are needed. The chip model requires a deep understanding of computer architecture, network architecture, and programming languages. It also requires a good understanding of the principles of artificial intelligence, machine learning, and natural language processing. In addition, it requires a good knowledge of the hardware and software components of the chip model.
In conclusion, the 10AX022E4F27I3SG chip model is a powerful and efficient processor that can be used in a variety of applications, including advanced communication systems, intelligent systems, and future intelligent robots. It requires technical talents to effectively use the chip model, and it can provide powerful computing power for the development of future intelligent systems.
You May Also Be Interested In
4,923 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,845.6678 | $1,845.6678 |
| 10+ | $1,825.8219 | $18,258.2188 |
| 100+ | $1,726.5924 | $172,659.2430 |
| 1000+ | $1,627.3630 | $813,681.4900 |
| 10000+ | $1,488.4418 | $1,488,441.7500 |
| The price is for reference only, please refer to the actual quotation! | ||