Intel Corporation
10AX022E4F27I3LG
10AX022E4F27I3LG ECAD Model
10AX022E4F27I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E4F27I3LG Datasheet Download
10AX022E4F27I3LG Overview
The chip model 10AX022E4F27I3LG is a revolutionary piece of technology that has been designed to meet the demands of modern communication systems. This model is a highly advanced chip that has been designed to offer a wide range of features and capabilities. It is capable of providing both high-speed data transmission and reliable signal integrity for advanced communication systems.
The original design intention of the chip model 10AX022E4F27I3LG was to provide a cost-effective solution for communication systems that require high-speed data transmission and reliable signal integrity. The chip is designed with a low power consumption and low cost of ownership, making it a great choice for many communication systems. The chip also offers a wide range of features that can be used to improve the performance of communication systems.
The chip model 10AX022E4F27I3LG is also capable of being upgraded in the future. This allows users to upgrade their existing communication systems to the latest version of the chip. This upgrade will provide users with improved performance and increased reliability. Additionally, the chip model 10AX022E4F27I3LG is capable of being used in advanced communication systems, such as those used in the development and popularization of future intelligent robots.
When using the chip model 10AX022E4F27I3LG, it is important to understand the specific design requirements of the chip. This includes understanding the architecture, the features, and the limitations of the chip. Additionally, it is important to understand the potential risks associated with using the chip, such as the possibility of data loss or system failure. It is also important to understand the potential benefits of using the chip, such as improved performance and increased reliability.
In order to effectively use the chip model 10AX022E4F27I3LG, it is important to have the right technical skills. This includes understanding the architecture of the chip and how it works, as well as having a good understanding of the various features and capabilities of the chip. Additionally, it is important to have a good understanding of the potential risks and benefits associated with using the chip.
In conclusion, the chip model 10AX022E4F27I3LG is a revolutionary piece of technology that has been designed to meet the demands of modern communication systems. The chip is capable of providing both high-speed data transmission and reliable signal integrity for advanced communication systems. Additionally, the chip is capable of being upgraded in the future and can be used in the development and popularization of future intelligent robots. In order to effectively use the chip model 10AX022E4F27I3LG, it is important to have the right technical skills and to understand the architecture, features, and limitations of the chip.
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4,292 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,306.7647 | $2,306.7647 |
| 10+ | $2,281.9608 | $22,819.6082 |
| 100+ | $2,157.9412 | $215,794.1214 |
| 1000+ | $2,033.9216 | $1,016,960.8020 |
| 10000+ | $1,860.2942 | $1,860,294.1500 |
| The price is for reference only, please refer to the actual quotation! | ||