
Intel Corporation
10AX022E4F27E3SG
10AX022E4F27E3SG ECAD Model
10AX022E4F27E3SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 240 | |
Number of Outputs | 240 | |
Number of Logic Cells | 220000 | |
Number of CLBs | 8033 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 8033 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA672,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA672,26X26,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX022E4F27E3SG Datasheet Download
10AX022E4F27E3SG Overview
The chip model 10AX022E4F27E3SG is a state-of-the-art integrated circuit (IC) developed by a leading semiconductor company. It is designed to meet the requirements of a wide range of applications, from industrial to consumer electronics. This chip offers a number of advantages over traditional ICs, such as increased power efficiency, higher speed, and improved reliability.
The 10AX022E4F27E3SG chip is expected to be in high demand in the coming years, as the demand for advanced integrated circuits continues to grow. This chip is ideal for use in a variety of network applications, such as wireless communication, data storage, and artificial intelligence. It is also well suited for use in intelligent applications, such as autonomous vehicles, robotics, and home automation.
The 10AX022E4F27E3SG chip model has a number of features that make it an attractive option for many applications. It is designed with a low-power, high-speed architecture that allows it to process data quickly and efficiently. It also has a wide range of input and output ports, allowing it to be easily integrated into existing systems. Additionally, it is designed with a variety of safety features, such as over-voltage and over-current protection, to ensure reliable operation.
The 10AX022E4F27E3SG chip model is a versatile and reliable IC that is well suited for a wide range of applications. It can be used in a variety of industrial and consumer applications, from wireless communication to home automation. It is also well suited for use in the era of fully intelligent systems, as it is designed to be able to process data quickly and efficiently.
Case studies have shown that the 10AX022E4F27E3SG chip is a reliable and efficient IC that can be used in a variety of applications. For example, it has been used in a number of industrial applications, such as medical equipment and industrial automation. Additionally, it has been used in consumer applications, such as home automation and wireless communication.
When using the 10AX022E4F27E3SG chip, it is important to consider a number of factors, such as power requirements, temperature, and the environment. Additionally, it is important to ensure that the chip is properly integrated into the system and that the system is properly configured for the chip's specific requirements. It is also important to ensure that the chip is compatible with the system's other components.
In conclusion, the 10AX022E4F27E3SG chip model is an advanced integrated circuit that is well suited for a variety of applications, from industrial to consumer electronics. It is expected to be in high demand in the coming years, as the demand for advanced integrated circuits continues to grow. It is also well suited for use in the era of fully intelligent systems, as it is designed to be able to process data quickly and efficiently. When using the 10AX022E4F27E3SG chip, it is important to consider a number of factors, such as power requirements, temperature, and the environment. Additionally, it is important to ensure that the chip is properly integrated into the system and that the system is properly configured for the chip's specific requirements.
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1,181 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $351.9120 | $351.9120 |
10+ | $348.1280 | $3,481.2800 |
100+ | $329.2080 | $32,920.8000 |
1000+ | $310.2880 | $155,144.0000 |
10000+ | $283.8000 | $283,800.0000 |
The price is for reference only, please refer to the actual quotation! |