Intel Corporation
10AX022E3F29I2LG
10AX022E3F29I2LG ECAD Model
10AX022E3F29I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E3F29I2LG Datasheet Download
10AX022E3F29I2LG Overview
The chip model 10AX022E3F29I2LG is a high-performance chip model that is suitable for a variety of applications including digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, which is a high-level language used for programming digital logic. This makes the chip model 10AX022E3F29I2LG a great choice for applications that require high-performance processing capabilities.
The chip model 10AX022E3F29I2LG has a number of advantages over other chip models. It is highly efficient and provides a high degree of accuracy and precision. It is also able to process data quickly and accurately, making it ideal for applications that require quick response times. Additionally, the chip model 10AX022E3F29I2LG is relatively low cost compared to other models, making it a great choice for those on a budget.
In terms of future industry trends, the chip model 10AX022E3F29I2LG is expected to remain in high demand. This is due to its ability to provide high-performance processing capabilities at a relatively low cost. Additionally, as new technologies continue to be developed, the chip model 10AX022E3F29I2LG will likely be adapted to support these technologies. This will provide users with even more efficient and accurate processing capabilities.
Overall, the chip model 10AX022E3F29I2LG is a great choice for applications that require high-performance digital signal processing, embedded processing, and image processing. It is highly efficient, accurate, and provides quick response times. Additionally, it is relatively low cost compared to other chip models, making it a great choice for those on a budget. As new technologies continue to be developed, the chip model 10AX022E3F29I2LG is expected to remain in high demand and be adapted to support these new technologies.
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3,299 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $3,171.4311 | $3,171.4311 |
| 10+ | $3,137.3297 | $31,373.2972 |
| 100+ | $2,966.8227 | $296,682.2670 |
| 1000+ | $2,796.3156 | $1,398,157.8100 |
| 10000+ | $2,557.6058 | $2,557,605.7500 |
| The price is for reference only, please refer to the actual quotation! | ||