
Intel Corporation
10AX022E3F29I1HG
10AX022E3F29I1HG ECAD Model
10AX022E3F29I1HG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Number of Inputs | 288 | |
Number of Outputs | 288 | |
Number of Logic Cells | 220000 | |
Number of CLBs | 8033 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 8033 CLBS | |
JESD-30 Code | S-PBGA-B780 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FBGA-780 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX022E3F29I1HG Datasheet Download
10AX022E3F29I1HG Overview
The chip model 10AX022E3F29I1HG is a highly advanced and powerful processor designed to meet the needs of today’s modern technology. It is a low-power, high-performance processor which provides a wide range of features and capabilities that make it suitable for a variety of applications. Its features include a high-speed, low-latency, and multi-core architecture, as well as a wide range of memory options. This makes it suitable for a wide range of tasks, from simple data processing to complex software development.
The chip model 10AX022E3F29I1HG offers several advantages over other processors. Its low power consumption makes it an ideal choice for embedded applications, while its multi-core architecture allows for increased performance and scalability. Additionally, its high speed and low latency make it well-suited for applications that require rapid data processing. This makes the chip model 10AX022E3F29I1HG highly suitable for use in industries such as telecommunications, automotive, and medical devices.
The chip model 10AX022E3F29I1HG is expected to experience a high demand in the future, as more and more industries begin to utilize its features and capabilities. It is well-suited for the development of advanced communication systems, as it has the ability to handle large amounts of data quickly and accurately. Additionally, its low power consumption makes it an ideal choice for embedded applications, as it can help reduce the cost of power consumption.
The original design intention of the chip model 10AX022E3F29I1HG was to provide a powerful and reliable processor for use in a variety of applications. It is capable of handling large amounts of data quickly and accurately, making it suitable for a wide range of tasks. Additionally, its low power consumption makes it an ideal choice for embedded applications, as it can help reduce the cost of power consumption.
The chip model 10AX022E3F29I1HG can be upgraded in the future to provide increased performance and scalability. This will allow it to be used in more advanced applications, such as the development and popularization of future intelligent robots. To use the chip model 10AX022E3F29I1HG effectively, technical talents such as software engineers, hardware engineers, and system architects are required. These professionals will be able to utilize the chip model 10AX022E3F29I1HG to its full potential, allowing for the development of advanced communication systems and other applications.
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4,280 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,898.4812 | $2,898.4812 |
10+ | $2,867.3148 | $28,673.1478 |
100+ | $2,711.4825 | $271,148.2455 |
1000+ | $2,555.6501 | $1,277,825.0650 |
10000+ | $2,337.4849 | $2,337,484.8750 |
The price is for reference only, please refer to the actual quotation! |