10AX022E3F29I1HG
10AX022E3F29I1HG
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rohs

Intel Corporation

10AX022E3F29I1HG


10AX022E3F29I1HG
F18-10AX022E3F29I1HG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, FBGA-780
FBGA-780

10AX022E3F29I1HG ECAD Model


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10AX022E3F29I1HG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Number of Inputs 288
Number of Outputs 288
Number of Logic Cells 220000
Number of CLBs 8033
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 8033 CLBS
JESD-30 Code S-PBGA-B780
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description FBGA-780
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX022E3F29I1HG Datasheet Download


10AX022E3F29I1HG Overview



The chip model 10AX022E3F29I1HG is a highly advanced and powerful processor designed to meet the needs of today’s modern technology. It is a low-power, high-performance processor which provides a wide range of features and capabilities that make it suitable for a variety of applications. Its features include a high-speed, low-latency, and multi-core architecture, as well as a wide range of memory options. This makes it suitable for a wide range of tasks, from simple data processing to complex software development.


The chip model 10AX022E3F29I1HG offers several advantages over other processors. Its low power consumption makes it an ideal choice for embedded applications, while its multi-core architecture allows for increased performance and scalability. Additionally, its high speed and low latency make it well-suited for applications that require rapid data processing. This makes the chip model 10AX022E3F29I1HG highly suitable for use in industries such as telecommunications, automotive, and medical devices.


The chip model 10AX022E3F29I1HG is expected to experience a high demand in the future, as more and more industries begin to utilize its features and capabilities. It is well-suited for the development of advanced communication systems, as it has the ability to handle large amounts of data quickly and accurately. Additionally, its low power consumption makes it an ideal choice for embedded applications, as it can help reduce the cost of power consumption.


The original design intention of the chip model 10AX022E3F29I1HG was to provide a powerful and reliable processor for use in a variety of applications. It is capable of handling large amounts of data quickly and accurately, making it suitable for a wide range of tasks. Additionally, its low power consumption makes it an ideal choice for embedded applications, as it can help reduce the cost of power consumption.


The chip model 10AX022E3F29I1HG can be upgraded in the future to provide increased performance and scalability. This will allow it to be used in more advanced applications, such as the development and popularization of future intelligent robots. To use the chip model 10AX022E3F29I1HG effectively, technical talents such as software engineers, hardware engineers, and system architects are required. These professionals will be able to utilize the chip model 10AX022E3F29I1HG to its full potential, allowing for the development of advanced communication systems and other applications.



4,280 In Stock


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Unit Price: $3,116.6465
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Pricing (USD)

QTY Unit Price Ext Price
1+ $2,898.4812 $2,898.4812
10+ $2,867.3148 $28,673.1478
100+ $2,711.4825 $271,148.2455
1000+ $2,555.6501 $1,277,825.0650
10000+ $2,337.4849 $2,337,484.8750
The price is for reference only, please refer to the actual quotation!

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