Intel Corporation
10AX022E3F29E1HG
10AX022E3F29E1HG ECAD Model
10AX022E3F29E1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E3F29E1HG Datasheet Download
10AX022E3F29E1HG Overview
Chip model 10AX022E3F29E1HG is an advanced integrated circuit (IC) designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is developed using the HDL (Hardware Description Language) language, which is a powerful language for describing the behavior of digital systems.
The chip model 10AX022E3F29E1HG is designed to meet the needs of modern digital signal processing applications, providing high-performance processing capabilities and a wide range of features. It has a wide range of applications, including industrial automation, medical imaging, and other embedded applications.
The industry trends of the chip model 10AX022E3F29E1HG and the future development of related industries depend on the specific technologies needed. As technology advances, the chip model 10AX022E3F29E1HG will likely be used in a variety of new applications. For example, it can be used in the development and popularization of future intelligent robots, providing the necessary computing power and processing capabilities.
To use the chip model 10AX022E3F29E1HG effectively, technical talent is needed. This includes knowledge of HDL language, as well as a deep understanding of digital signal processing and embedded computing. Additionally, familiarity with the chip model and its features is essential. With the right combination of technical knowledge and expertise, the chip model 10AX022E3F29E1HG can be used to create powerful solutions for a variety of applications.
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1,622 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,537.4397 | $2,537.4397 |
| 10+ | $2,510.1554 | $25,101.5542 |
| 100+ | $2,373.7339 | $237,373.3926 |
| 1000+ | $2,237.3124 | $1,118,656.2180 |
| 10000+ | $2,046.3224 | $2,046,322.3500 |
| The price is for reference only, please refer to the actual quotation! | ||