Intel Corporation
10AX022E3F27E2SG
10AX022E3F27E2SG ECAD Model
10AX022E3F27E2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E3F27E2SG Datasheet Download
10AX022E3F27E2SG Overview
The chip model 10AX022E3F27E2SG is an integrated circuit designed for advanced communication systems. It is a high-performance, low-cost solution for a wide range of applications. It is a single-chip solution that integrates multiple functions such as data transmission, signal processing, and control. The design intention of the chip model 10AX022E3F27E2SG is to provide a cost-effective solution for the development of advanced communication systems.
The product description and specific design requirements of the chip model 10AX022E3F27E2SG include a high-speed data transmission rate, a low-power consumption, and a wide range of operating frequencies. The chip model also has an integrated memory, which is used to store data and instructions. It has a built-in voltage regulator and can be used with a variety of external components. The chip model is also designed to be compatible with a variety of communication protocols, making it suitable for use in a variety of applications.
In terms of the possibility of future upgrades, the chip model 10AX022E3F27E2SG can be upgraded by adding additional components and features. This will enable the chip model to be used in more advanced applications. Furthermore, the chip model can be used in the development and popularization of future intelligent robots. To effectively use the chip model, technical talents such as electrical engineers, computer scientists, and software engineers are needed.
When using the chip model 10AX022E3F27E2SG, it is important to be aware of the potential risks and precautions. For example, the chip model should not be exposed to excessive heat or moisture, as this can cause damage to the chip model or its components. Furthermore, the chip model should be installed and operated in accordance with the manufacturer's instructions.
In conclusion, the chip model 10AX022E3F27E2SG is a high-performance, low-cost solution for advanced communication systems. It is possible to upgrade the chip model in the future and it can be used in the development and popularization of future intelligent robots. However, it is important to be aware of the potential risks and precautions when using the chip model.
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2,393 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,027.3545 | $2,027.3545 |
| 10+ | $2,005.5550 | $20,055.5501 |
| 100+ | $1,896.5575 | $189,655.7457 |
| 1000+ | $1,787.5599 | $893,779.9510 |
| 10000+ | $1,634.9633 | $1,634,963.3250 |
| The price is for reference only, please refer to the actual quotation! | ||