Intel Corporation
10AX022E3F27E1SG
10AX022E3F27E1SG ECAD Model
10AX022E3F27E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 220000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E3F27E1SG Overview
The chip model 10AX022E3F27E1SG is a powerful semiconductor solution that offers a wide range of advantages for various industries. It is designed to meet the needs of a wide range of applications such as networking, embedded systems, and communication systems. It is a highly efficient and reliable solution for modern communication systems.
The 10AX022E3F27E1SG chip model is designed to provide a great level of performance and reliability, as well as a low power consumption. It is designed to provide a high level of performance in terms of data speed and high data throughput. It also features advanced features such as high-speed serial interfaces, low-latency operation, and low power consumption. This makes it a great choice for communication systems and networks.
The chip model 10AX022E3F27E1SG is expected to experience a surge in demand in the future due to its powerful features and performance. It is expected to be used in a variety of applications, such as in network infrastructure, embedded systems, and communication systems. It is also expected to be used in advanced communication systems, such as 5G networks and beyond.
The chip model 10AX022E3F27E1SG is also designed to be easily upgradable. This means that it can be used in the future with new features and technologies, such as increased data speeds, increased data throughput, and improved power efficiency. This makes it a great choice for communication systems and networks in the future.
The chip model 10AX022E3F27E1SG can also be used in a variety of intelligent scenarios in the future. It is expected to be used in the era of fully intelligent systems, such as the Internet of Things (IoT), artificial intelligence (AI), and machine learning (ML). It is also expected to be used in advanced communication systems, such as 5G networks and beyond.
Overall, the chip model 10AX022E3F27E1SG is a powerful and reliable semiconductor solution that offers a wide range of advantages for various industries. It is designed to provide a great level of performance and reliability, as well as a low power consumption. It is expected to experience a surge in demand in the future due to its powerful features and performance. It is also designed to be easily upgradable, making it a great choice for communication systems and networks in the future. Furthermore, it can be used in a variety of intelligent scenarios in the future, such as in the era of fully intelligent systems.
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5,601 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||