Intel Corporation
10AX022E3F27E1HG
10AX022E3F27E1HG ECAD Model
10AX022E3F27E1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| JESD-30 Code | S-PBGA-B672 | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-672 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022E3F27E1HG Datasheet Download
10AX022E3F27E1HG Overview
The chip model 10AX022E3F27E1HG is a powerful device that is designed for high-performance digital signal processing, embedded processing, image processing, and other applications. It is designed with the latest HDL language, which is the most suitable for advanced communication systems. With the help of this chip model, users can easily develop and popularize the future intelligent robots.
The original design intention of the chip model 10AX022E3F27E1HG is to provide users with a powerful and efficient device for digital signal processing, embedded processing, and image processing. It is designed with the latest HDL language and is able to provide high-performance performance. Moreover, it supports future upgrades and is capable of handling large amounts of data with ease.
The chip model 10AX022E3F27E1HG is suitable for the development and popularization of future intelligent robots. It is able to provide users with a powerful and efficient device for digital signal processing, embedded processing, and image processing. With the help of this chip model, users can easily develop and popularize the future intelligent robots. Moreover, it also supports future upgrades, making it suitable for advanced communication systems.
In order to use the chip model 10AX022E3F27E1HG effectively, users need to have knowledge in HDL language and be familiar with the design and implementation of digital signal processing, embedded processing, image processing, and other related applications. Moreover, users should also be familiar with the development and popularization of intelligent robots. With the necessary knowledge and skills, users can easily use the chip model 10AX022E3F27E1HG to develop and popularize the future intelligent robots.
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2,526 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,365.2463 | $2,365.2463 |
| 10+ | $2,339.8136 | $23,398.1355 |
| 100+ | $2,212.6498 | $221,264.9772 |
| 1000+ | $2,085.4860 | $1,042,742.9960 |
| 10000+ | $1,907.4567 | $1,907,456.7000 |
| The price is for reference only, please refer to the actual quotation! | ||