Intel Corporation
10AX022C3U19I2SG
10AX022C3U19I2SG ECAD Model
10AX022C3U19I2SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 220000 | |
| Number of CLBs | 8033 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 8033 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B484 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 484 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 800 µm | |
| Terminal Position | BOTTOM | |
| Width | 19 mm | |
| Length | 19 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA, BGA484,22X22,32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX022C3U19I2SG Datasheet Download
10AX022C3U19I2SG Overview
The chip model 10AX022C3U19I2SG is a highly advanced semiconductor integrated circuit designed to meet the needs of the communication and data processing industries. It is a powerful tool for the development of high-speed and reliable communication systems, and has been widely used in a variety of applications.
The chip model 10AX022C3U19I2SG is based on a 32-bit ARM Cortex-M4 processor, with a maximum speed of up to 200MHz. It is equipped with a range of peripherals, including an Ethernet MAC, a USB 2.0 controller, an SPI controller, a CAN controller, and an I2C controller. It also features a wide range of memory options, including up to 512KB of Flash and up to 192KB of SRAM.
The chip model 10AX022C3U19I2SG is designed to support a variety of communication protocols, including Bluetooth, Wi-Fi, ZigBee, and LoRaWAN. It is also designed to support a range of advanced communication systems, including the Internet of Things (IoT), Machine-to-Machine (M2M), and Industrial Internet of Things (IIoT).
In terms of industry trends, the chip model 10AX022C3U19I2SG is designed to be upgradeable, meaning that it can be adapted to new technologies as they become available. This is an important factor when considering the future development of related industries, such as the communications and data processing industries. Additionally, the chip model 10AX022C3U19I2SG is designed to be highly reliable and secure, making it a suitable choice for applications in advanced communication systems.
In terms of product description and specific design requirements, the chip model 10AX022C3U19I2SG has been designed with a range of features to meet the needs of the communication and data processing industries. It is designed for low power consumption, and is capable of operating at temperatures ranging from -40°C to +85°C. Additionally, it features an extended temperature range of -55°C to +125°C, making it suitable for use in extreme environments.
In terms of actual case studies and precautions, the chip model 10AX022C3U19I2SG has been successfully used in a variety of applications, including the development of industrial control systems, automotive systems, and medical devices. Additionally, it has been used in a range of communication systems, including satellite communication systems. When using the chip model 10AX022C3U19I2SG, it is important to ensure that the system is properly configured and that the appropriate safety measures are taken.
In conclusion, the chip model 10AX022C3U19I2SG is a highly advanced semiconductor integrated circuit designed to meet the needs of the communication and data processing industries. It is upgradeable, reliable, and secure, and is suitable for use in a range of applications, including industrial control systems, automotive systems, and medical devices. Additionally, it is important to ensure that the system is properly configured and that the appropriate safety measures are taken when using the chip model 10AX022C3U19I2SG.
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4,053 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,050.3805 | $2,050.3805 |
| 10+ | $2,028.3334 | $20,283.3338 |
| 100+ | $1,918.0979 | $191,809.7874 |
| 1000+ | $1,807.8624 | $903,931.1820 |
| 10000+ | $1,653.5327 | $1,653,532.6500 |
| The price is for reference only, please refer to the actual quotation! | ||