
Intel Corporation
10AX016E4F29I3LG
10AX016E4F29I3LG ECAD Model
10AX016E4F29I3LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 288 | |
Number of Outputs | 288 | |
Number of Logic Cells | 160000 | |
Number of CLBs | 6151 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 6151 CLBS | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA784,28X28,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX016E4F29I3LG Datasheet Download
10AX016E4F29I3LG Overview
The chip model 10AX016E4F29I3LG is a powerful integrated circuit that has been designed for a variety of applications, ranging from communication systems to advanced intelligent scenarios. It is an ideal choice for those looking to upgrade their existing systems or build new ones that can be used in the era of fully intelligent systems.
The 10AX016E4F29I3LG chip model is designed to offer a range of features that make it suitable for a wide range of applications. It is capable of handling high-speed data transfer, making it an ideal choice for communication systems. It also has the ability to process complex algorithms quickly and accurately, making it suitable for intelligent scenarios. Additionally, the chip model is designed to be highly reliable and robust, making it suitable for long-term use.
The product description of the 10AX016E4F29I3LG chip model includes a range of features that make it a suitable choice for a variety of applications. It is designed to be highly energy efficient and is capable of handling a wide range of data transfer speeds. Additionally, the chip model is designed to be highly reliable and robust, making it suitable for long-term use.
When considering the 10AX016E4F29I3LG chip model for a particular application, there are a number of considerations that need to be taken into account, such as the power requirements, the data transfer speed, and the complexity of the algorithms that need to be processed. Additionally, it is important to consider the actual case studies that have been conducted with the chip model in order to ensure that the chip model is suitable for the specific application.
In conclusion, the 10AX016E4F29I3LG chip model is a powerful integrated circuit that has been designed for a variety of applications, ranging from communication systems to advanced intelligent scenarios. It is designed to offer a range of features that make it suitable for a wide range of applications, and is designed to be highly reliable and robust. When considering the chip model for a particular application, it is important to consider the power requirements, the data transfer speed, and the complexity of the algorithms that need to be processed, as well as actual case studies that have been conducted with the chip model.
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5,567 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $2,024.1063 | $2,024.1063 |
10+ | $2,002.3417 | $20,023.4173 |
100+ | $1,893.5188 | $189,351.8808 |
1000+ | $1,784.6959 | $892,347.9440 |
10000+ | $1,632.3438 | $1,632,343.8000 |
The price is for reference only, please refer to the actual quotation! |