Intel Corporation
10AX016E4F27I3SG
10AX016E4F27I3SG ECAD Model
10AX016E4F27I3SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 160000 | |
| Number of CLBs | 6151 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 6151 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX016E4F27I3SG Datasheet Download
10AX016E4F27I3SG Overview
Chip model 10AX016E4F27I3SG is a new generation of chip technology developed by Intel and is widely used in the communication industry. It is a low-power, low-cost, and high-performance solution for communication systems. This chip model is designed with the latest technologies and is capable of supporting advanced communication systems.
The chip model 10AX016E4F27I3SG is based on Intel's latest 10nm process technology, which enables it to achieve high performance and low power consumption. It also has an integrated Intel Atom processor with a large number of transistors and a low-power design. This chip model is capable of supporting a wide range of communication protocols, including Wi-Fi, Bluetooth, and LTE, as well as advanced communication systems such as 5G and 6G.
The chip model 10AX016E4F27I3SG is designed to be used in a wide range of applications, from consumer electronics to industrial applications. It can be used in networks and intelligent scenarios to provide a reliable and efficient solution. In the future, this chip model may be used in fully intelligent systems, such as self-driving cars, smart homes, and other intelligent scenarios.
In terms of industry trends, the chip model 10AX016E4F27I3SG is expected to become more and more popular in the communication industry and beyond. As new technologies emerge, it is likely that the chip model 10AX016E4F27I3SG will be upgraded to support the new technologies and be used in more advanced communication systems.
Overall, the chip model 10AX016E4F27I3SG is a reliable and efficient solution for communication systems. It has the capability to support a wide range of communication protocols and can be used in networks and intelligent scenarios. In the future, it is expected to be used in fully intelligent systems and may be upgraded to support new technologies. Therefore, the chip model 10AX016E4F27I3SG is a promising technology for the communication industry and beyond.
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5,736 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,488.0294 | $1,488.0294 |
| 10+ | $1,472.0291 | $14,720.2907 |
| 100+ | $1,392.0275 | $139,202.7492 |
| 1000+ | $1,312.0259 | $656,012.9560 |
| 10000+ | $1,200.0237 | $1,200,023.7000 |
| The price is for reference only, please refer to the actual quotation! | ||