Intel Corporation
10AX016E4F27I3LG
10AX016E4F27I3LG ECAD Model
10AX016E4F27I3LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 160000 | |
| Number of CLBs | 6151 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 6151 CLBS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX016E4F27I3LG Datasheet Download
10AX016E4F27I3LG Overview
The chip model 10AX016E4F27I3LG is a groundbreaking technology that has been designed to revolutionize the way we use and interact with technology. It is a powerful chip that offers a wide variety of features and capabilities that make it highly versatile and suitable for a wide range of applications.
The original design intention of the chip model 10AX016E4F27I3LG was to provide a reliable and efficient solution for a wide range of communication systems. This chip model is designed to be used in both traditional and advanced communication systems, making it ideal for use in both the present and the future. It is designed to be highly reliable and efficient, making it suitable for use in a wide range of communication applications.
The chip model 10AX016E4F27I3LG is also designed to be highly scalable and upgradeable, allowing it to be used in a wide range of applications and scenarios. This makes it ideal for use in the era of fully intelligent systems, where it can be used to power a wide range of intelligent applications. This chip model can be used to power a wide range of applications, from simple network communications to complex intelligent systems.
The product description and specific design requirements of the chip model 10AX016E4F27I3LG are well documented, making it easy for engineers to understand and use this chip model. The chip model is designed to provide a reliable and efficient solution for a wide range of communication applications, making it suitable for use in a wide range of scenarios. The chip model is also designed to be highly upgradeable, allowing it to be used in a wide range of applications and scenarios.
Actual case studies and precautions should be taken when using the chip model 10AX016E4F27I3LG. This chip model is designed to be highly reliable and efficient, but it is important to understand the specific design requirements and precautions that must be taken when using this chip model. This will ensure that the chip model is used correctly and safely, and that it is able to provide the expected performance and reliability.
In conclusion, the chip model 10AX016E4F27I3LG is a groundbreaking technology that has been designed to revolutionize the way we use and interact with technology. It is a powerful chip that offers a wide variety of features and capabilities that make it highly versatile and suitable for a wide range of applications. It is designed to be highly reliable and efficient, making it suitable for use in a wide range of communication applications. It is also designed to be highly scalable and upgradeable, allowing it to be used in a wide range of applications and scenarios, including the era of fully intelligent systems. Actual case studies and precautions should be taken when using the chip model 10AX016E4F27I3LG, to ensure that it is used correctly and safely, and that it is able to provide the expected performance and reliability.
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5,905 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,861.9141 | $1,861.9141 |
| 10+ | $1,841.8935 | $18,418.9354 |
| 100+ | $1,741.7906 | $174,179.0634 |
| 1000+ | $1,641.6877 | $820,843.8620 |
| 10000+ | $1,501.5437 | $1,501,543.6500 |
| The price is for reference only, please refer to the actual quotation! | ||