Intel Corporation
10AX016E3F29I2LG
10AX016E3F29I2LG ECAD Model
10AX016E3F29I2LG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 160000 | |
| Number of CLBs | 6151 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 6151 CLBS | |
| Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, BGA784,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX016E3F29I2LG Datasheet Download
10AX016E3F29I2LG Overview
The chip model 10AX016E3F29I2LG has been a popular choice for many industries due to its reliable performance and cost-effectiveness. It is a highly integrated and powerful chip that is designed to meet the needs of a wide range of applications. It is capable of supporting a variety of data transfer protocols, as well as providing high-speed data processing and storage capabilities.
As the world moves ever closer to the era of fully intelligent systems, the chip model 10AX016E3F29I2LG has the potential to become an integral part of the future of communication networks. Its ability to support multiple data transfer protocols makes it an ideal choice for use in advanced communication systems. Its powerful processing and storage capabilities also make it a suitable choice for applications in intelligent scenarios.
The chip model 10AX016E3F29I2LG is designed to be highly adaptable and upgradeable. This means that it can be used in a variety of different scenarios, and is capable of being upgraded to meet the needs of the future. This makes it a great choice for applications in the era of fully intelligent systems, as it is capable of being upgraded to meet the changing needs of the industry.
In order to determine the specific technologies that are needed to support the application environment of the chip model 10AX016E3F29I2LG, it is important to consider the current industry trends and the future development of related industries. It is also important to consider the original design intention of the chip model 10AX016E3F29I2LG, and the possibility of future upgrades.
The chip model 10AX016E3F29I2LG is a powerful and reliable chip that is capable of supporting a variety of data transfer protocols. Its potential applications in the era of fully intelligent systems, as well as its upgradeable design, make it an ideal choice for many industries. By considering the current industry trends and the future development of related industries, as well as the original design intention of the chip model 10AX016E3F29I2LG, it is possible to determine the specific technologies that will be needed to support the application environment.
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2,330 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,596.2704 | $2,596.2704 |
| 10+ | $2,568.3535 | $25,683.5351 |
| 100+ | $2,428.7691 | $242,876.9082 |
| 1000+ | $2,289.1847 | $1,144,592.3260 |
| 10000+ | $2,093.7665 | $2,093,766.4500 |
| The price is for reference only, please refer to the actual quotation! | ||