Intel Corporation
10AX016E3F29I1SG
10AX016E3F29I1SG ECAD Model
10AX016E3F29I1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 160000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B780 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA780,28X28,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX016E3F29I1SG Overview
The chip model 10AX016E3F29I1SG is a powerful tool for modern digital signal processing, embedded processing, and image processing. Its use requires the knowledge of HDL language, which is a hardware description language used to program digital logic circuits. It is suitable for a variety of applications, from high-end networking to embedded systems and image processing.
The chip model 10AX016E3F29I1SG is well-suited for the development of future intelligent systems. It can be used to create intelligent networks, where data can be exchanged and processed in real-time. It can also be used to develop and popularize future intelligent robots, providing the necessary hardware for the development of advanced AI systems.
The chip model 10AX016E3F29I1SG can be used to develop fully intelligent systems, such as self-driving cars or intelligent home automation. It offers a powerful platform for the development of such systems, allowing for the integration of various sensors, cameras, and other hardware components.
To use the chip model 10AX016E3F29I1SG effectively, it is important to have a good understanding of HDL language. It is also important to have a good understanding of digital signal processing, embedded processing, and image processing. Technical talents such as engineers, computer scientists, and software developers will be needed to effectively use the chip model 10AX016E3F29I1SG for the development of future intelligent systems.
You May Also Be Interested In
1,886 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||