Intel Corporation
10AX016E3F29I1HG
10AX016E3F29I1HG ECAD Model
10AX016E3F29I1HG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Number of Inputs | 288 | |
| Number of Outputs | 288 | |
| Number of Logic Cells | 160000 | |
| Number of CLBs | 6151 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | TSMC | |
| Organization | 6151 CLBS | |
| JESD-30 Code | S-PBGA-B780 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA780,28X28,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 29 mm | |
| Length | 29 mm | |
| Seated Height-Max | 3.35 mm | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | FBGA-780 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX016E3F29I1HG Datasheet Download
10AX016E3F29I1HG Overview
The chip model 10AX016E3F29I1HG is a new development in the chip industry, and it has been gaining traction in recent years. This model is designed to meet the needs of a variety of applications, such as embedded systems, communication systems, and consumer electronics. It is a highly integrated chip that combines a variety of features into one, such as a high-efficiency processor, a large-capacity memory, and a wide range of peripherals.
The 10AX016E3F29I1HG chip model has been designed to provide a cost-effective solution for a wide range of applications, while still offering the performance and features needed. It is also designed to be highly reliable and provide a long service life. This chip model is expected to be in high demand in the future, as it can provide a low-cost solution for many applications.
The original design intention of the 10AX016E3F29I1HG chip model was to provide a cost-effective solution for a variety of applications. The model was designed to provide a high level of performance and features, while still being cost-effective. It was also designed to be highly reliable and provide a long service life. The model is expected to be in high demand in the future, as it can provide a low-cost solution for many applications.
In terms of future development, the 10AX016E3F29I1HG chip model is expected to be upgraded in the future to provide better performance and more features. It is also expected to be able to support more advanced communication systems in the future. This means that the chip model will be able to provide a more cost-effective solution for a wide range of applications.
The chip model 10AX016E3F29I1HG is a highly integrated chip that combines a variety of features into one, and it is expected to be in high demand in the future. The model was designed to provide a cost-effective solution for a wide range of applications, while still offering the performance and features needed. In terms of future development, the model is expected to be upgraded in the future to provide better performance and more features. It is also expected to be able to support more advanced communication systems in the future. This chip model is a great choice for those looking for a cost-effective solution for their applications.
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5,324 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $2,371.9076 | $2,371.9076 |
| 10+ | $2,346.4032 | $23,464.0324 |
| 100+ | $2,218.8813 | $221,888.1321 |
| 1000+ | $2,091.3594 | $1,045,679.7030 |
| 10000+ | $1,912.8287 | $1,912,828.7250 |
| The price is for reference only, please refer to the actual quotation! | ||