10AX016E3F29E2LG
10AX016E3F29E2LG
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rohs

Intel Corporation

10AX016E3F29E2LG


10AX016E3F29E2LG
F18-10AX016E3F29E2LG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA784,28X28,40
BGA, BGA784,28X28,40

10AX016E3F29E2LG ECAD Model


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10AX016E3F29E2LG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 288
Number of Outputs 288
Number of Logic Cells 160000
Number of CLBs 6151
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology TSMC
Organization 6151 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B780
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 780
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA780,28X28,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 29 mm
Length 29 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA784,28X28,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX016E3F29E2LG Datasheet Download


10AX016E3F29E2LG Overview



The chip model 10AX016E3F29E2LG is a high-performance, integrated circuit designed for digital signal processing, embedded processing, and image processing. It is based on a high-level hardware description language (HDL) that enables users to create a wide range of applications. The chip has a high performance-to-power ratio and is suitable for a variety of applications requiring high-speed processing.


The 10AX016E3F29E2LG chip model has several advantages. It is capable of performing complex calculations and operations at high speeds, making it suitable for high-performance applications. It also has low power consumption, making it ideal for applications that require low power consumption. Additionally, the chip model is easy to use and program, allowing users to quickly develop applications for their specific needs.


The 10AX016E3F29E2LG chip model is expected to be in high demand in the future. With the increasing need for high-performance applications, the chip model has the potential to become the go-to solution for many applications. Additionally, the chip model is expected to be upgraded in the future to meet the changing needs of the market.


The original design intention of the chip model 10AX016E3F29E2LG was to provide high-performance processing capabilities with low power consumption. The chip model is expected to be able to handle complex calculations and operations at high speeds while consuming minimal power. Additionally, the chip model is expected to be easily programmable and upgradable to meet the changing needs of the market.


The 10AX016E3F29E2LG chip model has the potential to be applied to advanced communication systems. Its high-performance capabilities and low power consumption make it an ideal choice for communication systems that require high-speed processing. Additionally, its easy programmability and upgradability make it a suitable choice for communication systems that require frequent updates and changes.



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Unit Price: $548.00
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Pricing (USD)

QTY Unit Price Ext Price
1+ $509.6400 $509.6400
10+ $504.1600 $5,041.6000
100+ $476.7600 $47,676.0000
1000+ $449.3600 $224,680.0000
10000+ $411.0000 $411,000.0000
The price is for reference only, please refer to the actual quotation!

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