
Intel Corporation
10AX016E3F29E2LG
10AX016E3F29E2LG ECAD Model
10AX016E3F29E2LG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 900 mV | |
Number of Inputs | 288 | |
Number of Outputs | 288 | |
Number of Logic Cells | 160000 | |
Number of CLBs | 6151 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | TSMC | |
Organization | 6151 CLBS | |
Additional Feature | ALSO OPERATES AT 0.95V NOMINAL SUPPLY | |
Power Supplies | 900 mV | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B780 | |
Qualification Status | Not Qualified | |
Operating Temperature-Max | 100 °C | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Number of Terminals | 780 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA780,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 29 mm | |
Length | 29 mm | |
Seated Height-Max | 3.35 mm | |
Ihs Manufacturer | INTEL CORP | |
Package Description | BGA, BGA784,28X28,40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AX016E3F29E2LG Datasheet Download
10AX016E3F29E2LG Overview
The chip model 10AX016E3F29E2LG is a high-performance, integrated circuit designed for digital signal processing, embedded processing, and image processing. It is based on a high-level hardware description language (HDL) that enables users to create a wide range of applications. The chip has a high performance-to-power ratio and is suitable for a variety of applications requiring high-speed processing.
The 10AX016E3F29E2LG chip model has several advantages. It is capable of performing complex calculations and operations at high speeds, making it suitable for high-performance applications. It also has low power consumption, making it ideal for applications that require low power consumption. Additionally, the chip model is easy to use and program, allowing users to quickly develop applications for their specific needs.
The 10AX016E3F29E2LG chip model is expected to be in high demand in the future. With the increasing need for high-performance applications, the chip model has the potential to become the go-to solution for many applications. Additionally, the chip model is expected to be upgraded in the future to meet the changing needs of the market.
The original design intention of the chip model 10AX016E3F29E2LG was to provide high-performance processing capabilities with low power consumption. The chip model is expected to be able to handle complex calculations and operations at high speeds while consuming minimal power. Additionally, the chip model is expected to be easily programmable and upgradable to meet the changing needs of the market.
The 10AX016E3F29E2LG chip model has the potential to be applied to advanced communication systems. Its high-performance capabilities and low power consumption make it an ideal choice for communication systems that require high-speed processing. Additionally, its easy programmability and upgradability make it a suitable choice for communication systems that require frequent updates and changes.
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1,234 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $509.6400 | $509.6400 |
10+ | $504.1600 | $5,041.6000 |
100+ | $476.7600 | $47,676.0000 |
1000+ | $449.3600 | $224,680.0000 |
10000+ | $411.0000 | $411,000.0000 |
The price is for reference only, please refer to the actual quotation! |