10AX016E3F27I2SG
10AX016E3F27I2SG
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

Intel Corporation

10AX016E3F27I2SG


10AX016E3F27I2SG
F18-10AX016E3F27I2SG
Active
FIELD PROGRAMMABLE GATE ARRAY, TSMC, BGA, BGA672,26X26,40
BGA, BGA672,26X26,40

10AX016E3F27I2SG ECAD Model


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10AX016E3F27I2SG Attributes


Type Description Select
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 900 mV
Number of Inputs 240
Number of Outputs 240
Number of Logic Cells 160000
Number of CLBs 6151
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology TSMC
Organization 6151 CLBS
Additional Feature ALSO OPERATES AT 0.95V NOMINAL SUPPLY
Power Supplies 900 mV
Supply Voltage-Max 930 mV
Supply Voltage-Min 870 mV
JESD-30 Code S-PBGA-B672
Qualification Status Not Qualified
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Terminals 672
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA672,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 3.35 mm
Ihs Manufacturer INTEL CORP
Package Description BGA, BGA672,26X26,40
Reach Compliance Code compliant
HTS Code 8542.39.00.01

10AX016E3F27I2SG Datasheet Download


10AX016E3F27I2SG Overview



The chip model 10AX016E3F27I2SG is a highly advanced integrated circuit designed for use in a variety of communication systems. It is designed to provide reliable and efficient performance for a wide range of applications. The chip model was designed with the intention of providing a robust and reliable communication system that can be upgraded and adapted to meet the changing needs of the industry.


The 10AX016E3F27I2SG chip model is capable of providing high-speed data transmission, as well as efficient and reliable communication. The chip is also capable of being upgraded to meet the demands of the future. This includes the ability to support advanced communication systems, such as 5G, Wi-Fi 6, and more. It is also capable of being used in intelligent scenarios, such as machine learning, artificial intelligence, and autonomous systems.


The chip model 10AX016E3F27I2SG is designed to meet specific design requirements. It is designed to provide high-speed data transmission, as well as efficient and reliable communication. It is also designed to be able to upgrade and adapt to meet the changing needs of the industry. The design also includes features such as low power consumption, high-speed data transfer, and a wide range of available configurations.


In addition to the design specifications, there are also several case studies that provide insight into the performance of the chip model 10AX016E3F27I2SG. These studies provide information on the performance of the chip in various scenarios, as well as any potential issues that may arise. Additionally, there are several precautions that should be taken when using the chip model. These precautions include proper handling to avoid damage, as well as proper installation and configuration to ensure optimal performance.


The chip model 10AX016E3F27I2SG is an advanced integrated circuit designed for use in a variety of communication systems. It is designed to provide reliable and efficient performance for a wide range of applications, including those in the era of fully intelligent systems. The chip model is capable of being upgraded to meet the demands of the future, and is designed to meet specific design requirements. There are also several case studies and precautions that should be taken when using the chip model.



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Unit Price: $470.4027
The price is for reference only.
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Pricing (USD)

QTY Unit Price Ext Price
1+ $437.4745 $437.4745
10+ $432.7705 $4,327.7048
100+ $409.2503 $40,925.0349
1000+ $385.7302 $192,865.1070
10000+ $352.8020 $352,802.0250
The price is for reference only, please refer to the actual quotation!

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