Intel Corporation
10AX016E3F27E1SG
10AX016E3F27E1SG ECAD Model
10AX016E3F27E1SG Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 240 | |
| Number of Outputs | 240 | |
| Number of Logic Cells | 160000 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Power Supplies | 900 mV | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 100 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 3.25 mm | |
| Ihs Manufacturer | ALTERA CORP | |
| Package Description | BGA, BGA672,26X26,40 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 |
10AX016E3F27E1SG Overview
The chip model 10AX016E3F27E1SG is a revolutionary new product, designed to provide a wide range of features and benefits to a variety of industries. The chip model is the latest in a series of chips that are designed to be used in advanced communication systems, and offers a number of advantages over other models.
The chip model 10AX016E3F27E1SG is designed to provide a high level of performance and reliability. It is capable of providing high speed and low latency, making it ideal for applications in which speed and reliability are essential. Additionally, the chip model is designed to be highly energy efficient, which is an important factor for many industries.
The chip model 10AX016E3F27E1SG is designed to be easily upgradable, allowing users to take advantage of new technologies and features as they become available. This makes it an attractive option for those looking to stay ahead of the curve in terms of technology and performance. Additionally, the chip model is designed to be compatible with a wide range of communication systems, making it suitable for use in a variety of industries.
The product description of the chip model 10AX016E3F27E1SG describes it as a high-performance, low-power, and highly reliable chip that is designed for use in advanced communication systems. The chip model is designed to provide high-speed and low-latency performance, while also being energy efficient. Additionally, the chip model is designed to be easily upgradable, allowing users to take advantage of new technologies and features as they become available.
In terms of actual case studies, the chip model 10AX016E3F27E1SG has been used in a variety of industries, including the automotive, medical, and aerospace industries. In each of these industries, the chip model has proven to be reliable, efficient, and highly capable. Additionally, the chip model has been used in a variety of communication systems, ranging from Wi-Fi to satellite communications.
When using the chip model 10AX016E3F27E1SG, it is important to follow all instructions and precautions provided by the manufacturer. This includes ensuring that the chip is properly installed and maintained, and that all necessary safety measures are taken. Additionally, it is important to follow all applicable laws and regulations when using the chip model.
Given the advantages of the chip model 10AX016E3F27E1SG and its potential for future upgrades, it is expected that demand for the chip model will continue to increase in the coming years. The chip model is an attractive option for those looking to stay ahead of the curve in terms of technology and performance, and its compatibility with a wide range of communication systems makes it suitable for use in a variety of industries. As more industries begin to take advantage of the chip model's features and benefits, demand is expected to continue to rise.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||