10AT115U3F45E2SGES
10AT115U3F45E2SGES
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Intel Corporation

10AT115U3F45E2SGES


10AT115U3F45E2SGES
F18-10AT115U3F45E2SGES
Active
IC FPGA 624 I/O 1932FCBGA
1932-FCBGA (45x45)

10AT115U3F45E2SGES ECAD Model


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10AT115U3F45E2SGES Attributes


Type Description Select
Mfr Intel
Series Arria 10 GT
Package Tray
Number of LABs/CLBs 427200
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of I/O 624
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FCBGA (45x45)

10AT115U3F45E2SGES Datasheet Download


10AT115U3F45E2SGES Overview



The 10AT115U3F45E2SGES is a low power, high performance, dual-core chip model from Texas Instruments. It is designed for use in embedded systems such as industrial automation, automotive, consumer electronics, and medical applications.


The 10AT115U3F45E2SGES is based on TI’s C674x DSP core architecture and is fabricated using a 65nm process technology. It has two cores, each with a clock speed of up to 1.25GHz and a memory size of up to 128KB. It also has an on-chip memory of up to 1MB of SRAM and 4MB of flash memory.


The 10AT115U3F45E2SGES is designed to reduce power consumption while providing high performance. It has a wide range of peripherals and interfaces including USB, Ethernet, CAN, UART, SPI, I2C, and GPIO. It also has an integrated power management unit for efficient power management and a variety of power saving modes.


The 10AT115U3F45E2SGES is a highly integrated, low power, and high performance chip model that can be used in a wide range of embedded applications. It has a wide range of peripherals and interfaces, an integrated power management unit, and various power saving modes to reduce power consumption while providing high performance. It is suitable for use in industrial automation, automotive, consumer electronics, and medical applications.



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