10AT115U3F45E2SGE2
10AT115U3F45E2SGE2
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Intel Corporation

10AT115U3F45E2SGE2


10AT115U3F45E2SGE2
F18-10AT115U3F45E2SGE2
Active
IC FPGA 624 I/O 1932FCBGA
1932-FCBGA (45x45)

10AT115U3F45E2SGE2 ECAD Model


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10AT115U3F45E2SGE2 Attributes


Type Description Select
Mfr Intel
Series Arria 10 GT
Package Tray
Number of LABs/CLBs 427200
Number of Logic Elements/Cells 1150000
Total RAM Bits 68857856
Number of I/O 624
Voltage - Supply 0.87V ~ 0.93V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 1932-BBGA, FCBGA
Supplier Device Package 1932-FCBGA (45x45)

10AT115U3F45E2SGE2 Datasheet Download


10AT115U3F45E2SGE2 Overview



The 10AT115U3F45E2SGE2 is a low-power, low-voltage, single-channel, low-voltage differential signaling (LVDS) transceiver chip from Texas Instruments. It is designed to provide high-speed data transmission over short distances. The chip is capable of data rates up to 1.25 Gbps and is ideal for applications such as high-speed serial communication, computer peripherals, and consumer electronics.


The 10AT115U3F45E2SGE2 chip has a low power consumption of 2.0 mW (typical) and operates at a supply voltage of 2.5 V. It is also designed with a low jitter of 0.8 ns (typical) and a low power-down current of 1 µA (typical). The chip has a built-in ESD protection of 8 kV HBM and a thermal shutdown protection of 150°C.


The 10AT115U3F45E2SGE2 chip is available in a small, 8-pin VSSOP package and is ideal for embedded applications where space is limited. It is also compatible with a variety of LVDS standards, including the IEEE 1596.3-1996 standard.


The 10AT115U3F45E2SGE2 chip is suitable for a wide range of applications, including high-speed serial communication, computer peripherals, consumer electronics, and automotive systems. The chip can be used in applications such as flat panel displays, digital cameras, and networking equipment. It is also suitable for use in industrial automation and medical imaging systems.



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