
Intel Corporation
10AS066K2F40I1SG
10AS066K2F40I1SG ECAD Model
10AS066K2F40I1SG Attributes
Type | Description | Select |
---|---|---|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Supply Voltage-Nom | 900 mV | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Supply Voltage-Max | 930 mV | |
Supply Voltage-Min | 870 mV | |
JESD-30 Code | S-PBGA-B1517 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Number of Terminals | 1517 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 40 mm | |
Length | 40 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | ALTERA CORP | |
Package Description | 40 X 40 MM, ROHS COMPLIANT, FBGA-1517 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 |
10AS066K2F40I1SG Overview
The chip model 10AS066K2F40I1SG is an advanced chip designed to meet the needs of the communication industry. It is a multi-functional chip with a wide range of applications, including networks, intelligent scenarios, and more.
The original design intention of the chip model 10AS066K2F40I1SG was to provide a reliable and robust solution for communication systems. It is designed to be a highly efficient and cost-effective chip that can be used in a variety of applications. The chip is designed to be able to handle large amounts of data and can be used in applications such as wireless networks, optical networks, and more.
The chip model 10AS066K2F40I1SG is also designed with the possibility of future upgrades in mind. It is designed to be able to handle new and emerging technologies, such as 5G networks and the Internet of Things (IoT). It is also designed to be able to handle the increased demands of data-intensive applications, such as machine learning and artificial intelligence.
The chip model 10AS066K2F40I1SG can be used in a variety of intelligent scenarios. It is designed to be able to handle complex tasks, such as image processing, natural language processing, and more. It is also designed to be able to handle the increasingly demanding requirements of the modern communication industry, such as low latency and high throughput.
The chip model 10AS066K2F40I1SG is also designed to be able to handle the demands of the fully intelligent era. It is designed to be able to handle the large amounts of data and complex tasks required by intelligent systems, such as autonomous vehicles and robotic systems.
The product description and specific design requirements of the chip model 10AS066K2F40I1SG are detailed in the product datasheet. The datasheet outlines the chip’s features, such as its low power consumption, high performance, and wide range of applications. It also outlines the chip’s design requirements, such as its input/output pins and its operating voltage.
Actual case studies and precautions should also be taken into account when considering the use of the chip model 10AS066K2F40I1SG. It is important to consider the chip’s actual performance in real-world applications, as well as its potential limitations. It is also important to consider the chip’s compatibility with other components, as well as its ability to handle new and emerging technologies.
The chip model 10AS066K2F40I1SG is a reliable and robust solution for communication systems. It is designed to be able to handle large amounts of data and can be used in a variety of applications, including networks, intelligent scenarios, and more. It is also designed with the possibility of future upgrades in mind and is capable of handling the demands of the fully intelligent era. The product description and specific design requirements are outlined in the product datasheet, and actual case studies and precautions should be taken into account when considering the use of the chip.
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